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@ARTICLE{Persson:1026293,
      author       = {Persson, Bo and Mate, C. Mathew},
      title        = {{R}ole of humidity and surface roughness on direct wafer
                      bonding},
      journal      = {The European physical journal / B},
      volume       = {97},
      number       = {4},
      issn         = {1434-6028},
      address      = {Heidelberg},
      publisher    = {Springer},
      reportid     = {FZJ-2024-03364},
      pages        = {46},
      year         = {2024},
      abstract     = {Bodies made from elastically stiff material usually bind
                      very weakly unless the surfaces are flat and extremely
                      smooth. In direct wafer bonding flat surfaces bind by
                      capillary bridges and by the van der Waals interaction,
                      which act between all solid objects. Here we study the
                      dependency of the work of adhesion on the humidity and
                      surface roughness in hydrophilic direct wafer bonding. We
                      show that the long-wavelength roughness (usually denoted
                      waviness) has a negligible influence on the strength of
                      wafer bonding (the work of adhesion) from the menisci that
                      form from capillary condensation of water vapor.},
      cin          = {PGI-1},
      ddc          = {530},
      cid          = {I:(DE-Juel1)PGI-1-20110106},
      pnm          = {5211 - Topological Matter (POF4-521)},
      pid          = {G:(DE-HGF)POF4-5211},
      typ          = {PUB:(DE-HGF)16},
      UT           = {WOS:001204807200002},
      doi          = {10.1140/epjb/s10051-024-00680-w},
      url          = {https://juser.fz-juelich.de/record/1026293},
}