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@ARTICLE{Nguyen:1026670,
author = {Nguyen, Binh Duong and Steiner, Johannes and Wellmann,
Peter and Sandfeld, Stefan},
title = {{C}ombining unsupervised and supervised learning in
microscopy enables defect analysis of a full 4{H}-{S}i{C}
wafer},
journal = {MRS communications},
volume = {14},
issn = {2159-6859},
address = {Berlin},
publisher = {Springer},
reportid = {FZJ-2024-03488},
pages = {612-627},
year = {2024},
abstract = {Detecting and analyzing various defect types in
semiconductor materials is an important prerequisite for
understanding the underlying mechanisms and tailoring the
production processes. Analysis of microscopy images that
reveal defects typically requires image analysis tasks such
as segmentation and object detection. With the permanently
increasing amount of data from experiments, handling these
tasks manually becomes more and more impossible. In this
work, we combine various image analysis and data mining
techniques to create a robust and accurate, automated image
analysis pipeline for extracting the type and position of
all defects in a microscopy image of a KOH-etched 4H-SiC
wafer.},
cin = {IAS-9},
ddc = {670},
cid = {I:(DE-Juel1)IAS-9-20201008},
pnm = {5111 - Domain-Specific Simulation $\&$ Data Life Cycle Labs
(SDLs) and Research Groups (POF4-511)},
pid = {G:(DE-HGF)POF4-5111},
typ = {PUB:(DE-HGF)16},
UT = {WOS:001233735600001},
doi = {10.1557/s43579-024-00563-2},
url = {https://juser.fz-juelich.de/record/1026670},
}