TY  - CONF
AU  - Schön, Daniel
AU  - Menzel, Stephan
TI  - Understanding the Thermal Aspects in Dense RRAM Memory Arrays
M1  - FZJ-2024-03636
PY  - 2024
T2  - 2024 IEEE International Memory Workshop (IMW)
CY  - 12 May 2024 - 15 May 2024, Seoul (Korea)
Y2  - 12 May 2024 - 15 May 2024
M2  - Seoul, Korea
LB  - PUB:(DE-HGF)6
UR  - <Go to ISI:>//WOS:001233896700027
DO  - DOI:10.1109/IMW59701.2024.10536969
UR  - https://juser.fz-juelich.de/record/1027086
ER  -