Contribution to a conference proceedings/Contribution to a book FZJ-2025-04492

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Multimodal In Situ Electron Microscopy Platform for Correlative Electro-Thermal Characterization and Failure Analysis

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2025

: [Proceedings] - , 2025. - ISBN - doi:10.31399/asm.cp.istfa2025p0567
ISTFA 2025, Pasadena, CaliforniaPasadena, California, USA, 16 Nov 2025 - 20 Nov 20252025-11-162025-11-20
567-568 () [10.31399/asm.cp.istfa2025p0567]

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Abstract: We introduce a correlative in situ platform for electro-thermal studies in both TEM and SEM using the same MEMS-based Nano-Chip. Equipped with up to eight electrodes, the chip enables precise electrical biasing and localized heating of as prepared samples under real operating conditions. A dedicated SEM holder ensures seamless, damage-free transfer from TEM, combining atomic-scale imaging with SEM analytics (EDX, EBSD, TKD) and optional AFM integration. Designed for semiconductor materials, the system captures real-time structural evolution during heating and biasing, delivering artifact-free, multimodal insights for semiconductor reliability, device optimization, and advanced materials development.


Contributing Institute(s):
  1. Grundlagen der Elektrochemie (IET-1)
Research Program(s):
  1. 1231 - Electrochemistry for Hydrogen (POF4-123) (POF4-123)

Appears in the scientific report 2025
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 Record created 2025-11-12, last modified 2025-11-21


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