%0 Conference Paper
%A Zheng, Hongkui
%A Pivak, Yevheniy
%A Rossum, Christian Deen-van
%A Andersen, Mia
%A Pen, Merijn
%A Basak, Shibabrata
%A Eichel, Rüdiger-A
%A Garza, Hugo Pérez
%T Multimodal In Situ Electron Microscopy Platform for Correlative Electro-Thermal Characterization and Failure Analysis
%M FZJ-2025-04492
%P 567-568
%D 2025
%< : [Proceedings] - , 2025. - ISBN - doi:10.31399/asm.cp.istfa2025p0567
%X We introduce a correlative in situ platform for electro-thermal studies in both TEM and SEM using the same MEMS-based Nano-Chip. Equipped with up to eight electrodes, the chip enables precise electrical biasing and localized heating of as prepared samples under real operating conditions. A dedicated SEM holder ensures seamless, damage-free transfer from TEM, combining atomic-scale imaging with SEM analytics (EDX, EBSD, TKD) and optional AFM integration. Designed for semiconductor materials, the system captures real-time structural evolution during heating and biasing, delivering artifact-free, multimodal insights for semiconductor reliability, device optimization, and advanced materials development.
%B ISTFA 2025
%C 16 Nov 2025 - 20 Nov 2025, Pasadena, California (USA)
Y2 16 Nov 2025 - 20 Nov 2025
M2 Pasadena, California, USA
%F PUB:(DE-HGF)8 ; PUB:(DE-HGF)7
%9 Contribution to a conference proceedingsContribution to a book
%R 10.31399/asm.cp.istfa2025p0567
%U https://juser.fz-juelich.de/record/1048100