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001048100 037__ $$aFZJ-2025-04492
001048100 1001_ $$0P:(DE-HGF)0$$aZheng, Hongkui$$b0
001048100 1112_ $$aISTFA 2025$$cPasadena, California$$d2025-11-16 - 2025-11-20$$wUSA
001048100 245__ $$aMultimodal In Situ Electron Microscopy Platform for Correlative Electro-Thermal Characterization and Failure Analysis
001048100 260__ $$c2025
001048100 29510 $$a: [Proceedings] - , 2025. - ISBN - doi:10.31399/asm.cp.istfa2025p0567
001048100 300__ $$a567-568
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001048100 520__ $$aWe introduce a correlative in situ platform for electro-thermal studies in both TEM and SEM using the same MEMS-based Nano-Chip. Equipped with up to eight electrodes, the chip enables precise electrical biasing and localized heating of as prepared samples under real operating conditions. A dedicated SEM holder ensures seamless, damage-free transfer from TEM, combining atomic-scale imaging with SEM analytics (EDX, EBSD, TKD) and optional AFM integration. Designed for semiconductor materials, the system captures real-time structural evolution during heating and biasing, delivering artifact-free, multimodal insights for semiconductor reliability, device optimization, and advanced materials development.
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001048100 7001_ $$0P:(DE-HGF)0$$aPivak, Yevheniy$$b1
001048100 7001_ $$0P:(DE-HGF)0$$aRossum, Christian Deen-van$$b2
001048100 7001_ $$0P:(DE-HGF)0$$aAndersen, Mia$$b3
001048100 7001_ $$0P:(DE-HGF)0$$aPen, Merijn$$b4
001048100 7001_ $$0P:(DE-Juel1)180432$$aBasak, Shibabrata$$b5$$ufzj
001048100 7001_ $$0P:(DE-Juel1)156123$$aEichel, Rüdiger-A$$b6
001048100 7001_ $$0P:(DE-HGF)0$$aGarza, Hugo Pérez$$b7
001048100 773__ $$a10.31399/asm.cp.istfa2025p0567
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