TY  - CONF
AU  - Zheng, Hongkui
AU  - Pivak, Yevheniy
AU  - Rossum, Christian Deen-van
AU  - Andersen, Mia
AU  - Pen, Merijn
AU  - Basak, Shibabrata
AU  - Eichel, Rüdiger-A
AU  - Garza, Hugo Pérez
TI  - Multimodal In Situ Electron Microscopy Platform for Correlative Electro-Thermal Characterization and Failure Analysis
M1  - FZJ-2025-04492
SP  - 567-568
PY  - 2025
AB  - We introduce a correlative in situ platform for electro-thermal studies in both TEM and SEM using the same MEMS-based Nano-Chip. Equipped with up to eight electrodes, the chip enables precise electrical biasing and localized heating of as prepared samples under real operating conditions. A dedicated SEM holder ensures seamless, damage-free transfer from TEM, combining atomic-scale imaging with SEM analytics (EDX, EBSD, TKD) and optional AFM integration. Designed for semiconductor materials, the system captures real-time structural evolution during heating and biasing, delivering artifact-free, multimodal insights for semiconductor reliability, device optimization, and advanced materials development.
T2  - ISTFA 2025
CY  - 16 Nov 2025 - 20 Nov 2025, Pasadena, California (USA)
Y2  - 16 Nov 2025 - 20 Nov 2025
M2  - Pasadena, California, USA
LB  - PUB:(DE-HGF)8 ; PUB:(DE-HGF)7
DO  - DOI:10.31399/asm.cp.istfa2025p0567
UR  - https://juser.fz-juelich.de/record/1048100
ER  -