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| Hauptseite > Publikationsdatenbank > Multimodal In Situ Electron Microscopy Platform for Correlative Electro-Thermal Characterization and Failure Analysis > print |
| Hauptseite > Publikationsdatenbank > Multimodal In Situ Electron Microscopy Platform for Correlative Electro-Thermal Characterization and Failure Analysis > print |
| 001 | 1048100 | ||
| 005 | 20251121202209.0 | ||
| 024 | 7 | _ | |a 10.31399/asm.cp.istfa2025p0567 |2 doi |
| 037 | _ | _ | |a FZJ-2025-04492 |
| 100 | 1 | _ | |a Zheng, Hongkui |0 P:(DE-HGF)0 |b 0 |
| 111 | 2 | _ | |a ISTFA 2025 |c Pasadena, California |d 2025-11-16 - 2025-11-20 |w USA |
| 245 | _ | _ | |a Multimodal In Situ Electron Microscopy Platform for Correlative Electro-Thermal Characterization and Failure Analysis |
| 260 | _ | _ | |c 2025 |
| 295 | 1 | 0 | |a : [Proceedings] - , 2025. - ISBN - doi:10.31399/asm.cp.istfa2025p0567 |
| 300 | _ | _ | |a 567-568 |
| 336 | 7 | _ | |a CONFERENCE_PAPER |2 ORCID |
| 336 | 7 | _ | |a Conference Paper |0 33 |2 EndNote |
| 336 | 7 | _ | |a INPROCEEDINGS |2 BibTeX |
| 336 | 7 | _ | |a conferenceObject |2 DRIVER |
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| 520 | _ | _ | |a We introduce a correlative in situ platform for electro-thermal studies in both TEM and SEM using the same MEMS-based Nano-Chip. Equipped with up to eight electrodes, the chip enables precise electrical biasing and localized heating of as prepared samples under real operating conditions. A dedicated SEM holder ensures seamless, damage-free transfer from TEM, combining atomic-scale imaging with SEM analytics (EDX, EBSD, TKD) and optional AFM integration. Designed for semiconductor materials, the system captures real-time structural evolution during heating and biasing, delivering artifact-free, multimodal insights for semiconductor reliability, device optimization, and advanced materials development. |
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| 700 | 1 | _ | |a Pivak, Yevheniy |0 P:(DE-HGF)0 |b 1 |
| 700 | 1 | _ | |a Rossum, Christian Deen-van |0 P:(DE-HGF)0 |b 2 |
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| 700 | 1 | _ | |a Pen, Merijn |0 P:(DE-HGF)0 |b 4 |
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| 700 | 1 | _ | |a Garza, Hugo Pérez |0 P:(DE-HGF)0 |b 7 |
| 773 | _ | _ | |a 10.31399/asm.cp.istfa2025p0567 |
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| 914 | 1 | _ | |y 2025 |
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