% IMPORTANT: The following is UTF-8 encoded.  This means that in the presence
% of non-ASCII characters, it will not work with BibTeX 0.99 or older.
% Instead, you should use an up-to-date BibTeX implementation like “bibtex8” or
% “biber”.

@ARTICLE{Hilger:1055036,
      author       = {Hilger, Martin and Krogsgaard, Thorbjørn and
                      Groß-Barsnick, Sonja-Michaela and Sebold, Doris and
                      Shrikanth, S. and Froitzheim, Jan and Lenser, Christian and
                      Menzler, Norbert H.},
      title        = {{E}lectrophoretic {D}eposition of {P}rotective {S}pinel
                      {C}oatings for {S}olid {O}xide {C}ell {I}nterconnects –
                      {T}owards {S}tack {I}ntegration},
      journal      = {Journal of the Electrochemical Society},
      volume       = {173},
      number       = {3},
      issn         = {0013-4651},
      address      = {Bristol},
      publisher    = {IOP Publishing},
      reportid     = {FZJ-2026-01833},
      pages        = {034509},
      year         = {2026},
      abstract     = {We evaluated electrophoretic deposition (EPD) of spinel
                      coatings for solid oxide cell (SOC) interconnects with a
                      focus on stack integration. Two compositions, MnCo1.9Fe0.1O4
                      (MCF) and CuMn1.8Ni0.2O4 (CMN), were deposited from
                      water/ethanol suspensions and subjected to three thermal
                      routes: direct oxidation and two-step treatments with
                      reduction in Ar/H2 at 900 or 1000 °C followed by oxidation.
                      Structural evolution, chromium evaporation, mass gain, and
                      ex situ area-specific resistance (ASR) were assessed.
                      Sealant compatibility with a Ca-Ba-silicate glass and
                      applicability to representative flow-field geometries were
                      investigated. All coatings formed continuous layers;
                      two-step treatments enhanced densification compared to
                      direct oxidation. Prereduction of MCF layers at 1000 °C
                      yielded the lowest Cr evaporation and mass gain, whereas CMN
                      exhibited chromium ingress, phase variations, and coarsened
                      microstructures. ASR values for all types remained around or
                      below 20 mΩ cm2. Glass-joining produced dense composites;
                      limited cation diffusion was observed for MCF, while CMN
                      showed substantial Cu penetration into the glass. EPD
                      produced uniform, defect-free coatings on complex flow-field
                      structures, with only slight thickness variations across the
                      profile. These results support MCF-EPD with a 1000 °C
                      reduction step and in situ oxidation during stack assembly
                      as a process-compatible route for protective interconnect
                      coatings in high-temperature SOCs, while CMN remains of
                      particular interest for intermediate-temperature
                      applications.},
      organization  = {19th International Symposium on Solid
                       Oxide Fuel Cells, Stockholm (Sweden)},
      cin          = {IMD-2 / ITE},
      ddc          = {660},
      cid          = {I:(DE-Juel1)IMD-2-20101013 / I:(DE-Juel1)ITE-20250108},
      pnm          = {1231 - Electrochemistry for Hydrogen (POF4-123) / NOUVEAU -
                      NOVEL ELECTRODE COATINGS AND INTERCONNECT FOR SUSTAINABLE
                      AND REUSABLE SOEC (101058784) / SOFC - Solid Oxide Fuel Cell
                      (SOFC-20140602)},
      pid          = {G:(DE-HGF)POF4-1231 / G:(EU-Grant)101058784 /
                      G:(DE-Juel1)SOFC-20140602},
      typ          = {PUB:(DE-HGF)8 / PUB:(DE-HGF)16},
      doi          = {10.1149/1945-7111/ae3ebb},
      url          = {https://juser.fz-juelich.de/record/1055036},
}