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@ARTICLE{Knoll:111886,
author = {Knoll, L. and Zhao, Q.T. and Lupták, R. and Trellenkamp,
S. and Bourdelle, K.K. and Mantl, S.},
title = {20 nm {G}ate length {S}chottky {MOSFET}s with ultra-thin
{N}i{S}i/epitaxial {N}i{S}i2 source/drain},
journal = {Solid state electronics},
volume = {71},
issn = {0038-1101},
address = {Oxford [u.a.]},
publisher = {Pergamon, Elsevier Science},
reportid = {PreJuSER-111886},
pages = {88 - 92},
year = {2012},
note = {Record converted from VDB: 16.11.2012},
abstract = {Schottky barrier (SB)-MOSFETs with NiSi and epitaxial NiSi2
S/D contacts with gate lengths as small as 20 nm are
presented. Epitaxial NiSi2 FETs show higher on-currents than
corresponding NiSi devices due to its lower SB height. A
striking observation is that tunnelling currents through the
fairly large SB decrease at very short gate lengths in
SB-MOSFETs, in contrast to the scaling behavior of
conventional MOSFETs. Simulations indicate that the
potential in the channel increases due to overlap of the
high source and drain barriers with decreasing gate length,
leading to lower currents. Boron implantation into the
silicide (IIS) was used to lower the SBH. Devices with
epitaxial NiSi2 show an improved performance after barrier
lowering by (IIS). It is shown, that the parasitic potential
increase of the two S/D Schottky barriers can be either
minimized by IIS and by enhanced gate control due to EOT
scaling using high-k as the gate oxide. (C) 2011 Elsevier
Ltd. All rights reserved.},
keywords = {J (WoSType)},
cin = {JARA-FIT / PGI-9},
ddc = {530},
cid = {$I:(DE-82)080009_20140620$ / I:(DE-Juel1)PGI-9-20110106},
pnm = {Grundlagen für zukünftige Informationstechnologien},
pid = {G:(DE-Juel1)FUEK412},
shelfmark = {Engineering, Electrical $\&$ Electronic / Physics, Applied
/ Physics, Condensed Matter},
typ = {PUB:(DE-HGF)16},
UT = {WOS:000303033800017},
doi = {10.1016/j.sse.2011.10.026},
url = {https://juser.fz-juelich.de/record/111886},
}