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@PHDTHESIS{Roeckerath:1292,
author = {Roeckerath, Jens Martin},
title = {{S}eltenerd-basierte ternäre {O}xide als alternative
{G}atedielektrika},
volume = {3},
school = {RWTH Aachen},
type = {Dr. (Univ.)},
address = {Jülich},
publisher = {Forschungszentrum Jülich GmbH Zentralbibliothek, Verlag},
reportid = {PreJuSER-1292},
isbn = {978-3-89336-543-2},
series = {Schriften des Forschungszentrums Jülich. Information /
Information},
pages = {148 S.},
year = {2008},
note = {Record converted from VDB: 12.11.2012; RWTH Aachen, Diss.,
2008},
abstract = {For the further scaling of silicon-based field effect
transistors the use of alternative gate dielectrics with
$\kappa$>20 – so called high-$\kappa$ dielectrics – is
crucial. Only with these materials the leakage currents in
the devices can be kept below a critical limit compared to
the so far used silicon dioxide. And, the ongoing reduction
of feature size of integrated circuits ist the basis for the
success of microelectronics industry during the last four
decades. Thermodynamic calculations predict that some rare
earth based ternary oxides (e.g. $\textit{RE}$ScO$_{3}$ or
$\textit{RERE}$O$_{3}$ with $\textit{RE}$ = Y, La or an
element from the lanthanide group) are stable in contact
with silicon and therefore being considered for the use as
alternative gate dielectrics. In this work, GdScO$_{3}$ and
LaLuO$_{3}$ thin films deposited with different techniques
(pulsed laser deposition, atomic layer deposition and
electron beam evaporation) were morphologically and
electrically characterized. The produced films are
stoichiometric, homogeneous and smooth. They reveal
dielectric constants as high as 23 for GdScO$_{3}$ and even
up to 32 for LaLuO$_{3}$, undisturbed C-V curves and low
leakage current densities. Furthermore, a process for the
integration of GdScO$_{3}$ as gate dielectric into
silicon-based field effect transistors was developed. The
prepared devices show normal transfer and output
characteristics. Carrier mobilities of about 120 cm$^{2}$/Vs
for bulk silicon and 155 cm$^{2}$/Vs for silicon on
insulator substrates were determined. The use of strained
silicon yields an improvement of 140\% for the carrier
mobility and about 30\% for the maximum drain current and a
doubling of the maximum transconductance. The integration of
GdScO$_{3}$ as gate dielectric into AlGaN/GaN-MISHFETs
resulted in a reduction of the gate leakage current by four
orders of magnitude, a doubling of the output power, and a
significant improvement of the power added efficiency. In
summary, the results of this work confirm the suitability of
the rare earth based ternary oxides GdScO$_{3}$ and
LaLuO$_{3}$ for the use as alternative gate dielectrics in
microelectronics.},
cin = {IBN-1},
ddc = {620},
cid = {I:(DE-Juel1)VDB799},
pnm = {Grundlagen für zukünftige Informationstechnologien},
pid = {G:(DE-Juel1)FUEK412},
typ = {PUB:(DE-HGF)11 / PUB:(DE-HGF)3},
url = {https://juser.fz-juelich.de/record/1292},
}