001     133812
005     20240610120406.0
024 7 _ |a 10.1016/j.mee.2013.03.066
|2 doi
024 7 _ |a 0167-9317
|2 ISSN
024 7 _ |a 1873-5568
|2 ISSN
024 7 _ |a WOS:000321229200031
|2 WOS
037 _ _ |a FZJ-2013-02206
082 _ _ |a 620
100 1 _ |a Nichau, Alexander
|0 P:(DE-Juel1)128618
|b 0
|u fzj
|e Corresponding author
245 _ _ |a Reduction of silicon dioxide interfacial layer to 4.6 A EOT by Al remote scavenging in high K/metal gate stacks on Si
260 _ _ |a [S.l.] @
|c 2013
|b Elsevier
336 7 _ |a Journal Article
|b journal
|m journal
|0 PUB:(DE-HGF)16
|s 1386859424_20645
|2 PUB:(DE-HGF)
336 7 _ |a Output Types/Journal article
|2 DataCite
336 7 _ |a Journal Article
|0 0
|2 EndNote
336 7 _ |a ARTICLE
|2 BibTeX
336 7 _ |a JOURNAL_ARTICLE
|2 ORCID
336 7 _ |a article
|2 DRIVER
500 _ _ |3 POF3_Assignment on 2016-02-29
520 _ _ |a The continued device scaling demands the reduction of the equivalent oxide thickness (EOT) below 1 nm. For HfO2-based gate stacks, the interfacial SiO2 limits the EOT scaling. A low EOT can only be achieved if the interfacial layer (IL) is reduced to its physical limit of ∼4 Å. Such thin EOT are achievable if redox reactions within the gate stack are employed in order to reduce SiO2. This study reports on the use of an Al layer in combination with a TiN metal electrode to reduce the IL and achieve lowest EOT values. The lowest EOT achieved was 4.6 Å. However, the scavenging process was found to strongly depend on the thermal budget after Al deposition. The presented process adapts a standard metal-inserted poly-Si flow (MIPS) prior to Al deposition, but may also be an option to control IL regrowth.
536 _ _ |a 421 - Frontiers of charge based Electronics (POF2-421)
|0 G:(DE-HGF)POF2-421
|c POF2-421
|x 0
|f POF II
536 _ _ |a 42G - Peter Grünberg-Centre (PG-C) (POF2-42G41)
|0 G:(DE-HGF)POF2-42G41
|c POF2-42G41
|x 1
|f POF II
588 _ _ |a Dataset connected to
700 1 _ |a Schäfer, Anna
|0 P:(DE-Juel1)144017
|b 1
700 1 _ |a Knoll, Lars
|0 P:(DE-Juel1)162211
|b 2
|u fzj
700 1 _ |a Wirths, Stephan
|0 P:(DE-Juel1)138778
|b 3
|u fzj
700 1 _ |a Schram, T.
|0 P:(DE-HGF)0
|b 4
700 1 _ |a Ragnarsson, L.-Å.
|0 P:(DE-HGF)0
|b 5
700 1 _ |a Schubert, Jürgen
|0 P:(DE-Juel1)128631
|b 6
700 1 _ |a Bernardy, Patric
|0 P:(DE-Juel1)138772
|b 7
|u fzj
700 1 _ |a Luysberg, Martina
|0 P:(DE-Juel1)130811
|b 8
|u fzj
700 1 _ |a Besmehn, Astrid
|0 P:(DE-Juel1)133839
|b 9
|u fzj
700 1 _ |a Breuer, Uwe
|0 P:(DE-Juel1)133840
|b 10
700 1 _ |a Buca, Dan Mihai
|0 P:(DE-Juel1)125569
|b 11
|u fzj
700 1 _ |a Mantl, Siegfried
|0 P:(DE-Juel1)128609
|b 12
|u fzj
773 _ _ |a 10.1016/j.mee.2013.03.066
|0 PERI:(DE-600)1497065-x
|v 109
|t Microelectronic engineering
|p 109 - 112
856 4 _ |u https://juser.fz-juelich.de/record/133812/files/FZJ-2013-02206.pdf
|y Restricted
909 _ _ |p VDB
|o oai:juser.fz-juelich.de:133812
909 C O |o oai:juser.fz-juelich.de:133812
|p VDB
910 1 _ |a Forschungszentrum Jülich GmbH
|0 I:(DE-588b)5008462-8
|k FZJ
|b 0
|6 P:(DE-Juel1)128618
910 1 _ |a Forschungszentrum Jülich GmbH
|0 I:(DE-588b)5008462-8
|k FZJ
|b 1
|6 P:(DE-Juel1)144017
910 1 _ |a Forschungszentrum Jülich GmbH
|0 I:(DE-588b)5008462-8
|k FZJ
|b 2
|6 P:(DE-Juel1)162211
910 1 _ |a Forschungszentrum Jülich GmbH
|0 I:(DE-588b)5008462-8
|k FZJ
|b 3
|6 P:(DE-Juel1)138778
910 1 _ |a Forschungszentrum Jülich GmbH
|0 I:(DE-588b)5008462-8
|k FZJ
|b 6
|6 P:(DE-Juel1)128631
910 1 _ |a Forschungszentrum Jülich GmbH
|0 I:(DE-588b)5008462-8
|k FZJ
|b 7
|6 P:(DE-Juel1)138772
910 1 _ |a Forschungszentrum Jülich GmbH
|0 I:(DE-588b)5008462-8
|k FZJ
|b 8
|6 P:(DE-Juel1)130811
910 1 _ |a Analytik
|0 I:(DE-Juel1)ZEA-3-20090406
|k ZEA-3
|b 9
|6 P:(DE-Juel1)133839
910 1 _ |a Forschungszentrum Jülich GmbH
|0 I:(DE-588b)5008462-8
|k FZJ
|b 9
|6 P:(DE-Juel1)133839
910 1 _ |a Analytik
|0 I:(DE-Juel1)ZEA-3-20090406
|k ZEA-3
|b 10
|6 P:(DE-Juel1)133840
910 1 _ |a Forschungszentrum Jülich GmbH
|0 I:(DE-588b)5008462-8
|k FZJ
|b 10
|6 P:(DE-Juel1)133840
910 1 _ |a Forschungszentrum Jülich GmbH
|0 I:(DE-588b)5008462-8
|k FZJ
|b 11
|6 P:(DE-Juel1)125569
910 1 _ |a Forschungszentrum Jülich GmbH
|0 I:(DE-588b)5008462-8
|k FZJ
|b 12
|6 P:(DE-Juel1)128609
913 2 _ |a DE-HGF
|b Key Technologies
|l Future Information Technology - Fundamentals, Novel Concepts and Energy Efficiency (FIT)
|1 G:(DE-HGF)POF3-520
|0 G:(DE-HGF)POF3-529H
|2 G:(DE-HGF)POF3-500
|v Addenda
|x 0
913 1 _ |a DE-HGF
|b Schlüsseltechnologien
|1 G:(DE-HGF)POF2-420
|0 G:(DE-HGF)POF2-421
|2 G:(DE-HGF)POF2-400
|v Frontiers of charge based Electronics
|x 0
|4 G:(DE-HGF)POF
|3 G:(DE-HGF)POF2
|l Grundlagen zukünftiger Informationstechnologien
913 1 _ |a DE-HGF
|b Schlüsseltechnologien
|1 G:(DE-HGF)POF2-420
|0 G:(DE-HGF)POF2-42G41
|2 G:(DE-HGF)POF2-400
|v Peter Grünberg-Centre (PG-C)
|x 1
|4 G:(DE-HGF)POF
|3 G:(DE-HGF)POF2
|l Grundlagen zukünftiger Informationstechnologien
914 1 _ |y 2013
915 _ _ |a JCR/ISI refereed
|0 StatID:(DE-HGF)0010
|2 StatID
915 _ _ |a JCR
|0 StatID:(DE-HGF)0100
|2 StatID
915 _ _ |a WoS
|0 StatID:(DE-HGF)0110
|2 StatID
|b Science Citation Index
915 _ _ |a WoS
|0 StatID:(DE-HGF)0111
|2 StatID
|b Science Citation Index Expanded
915 _ _ |a DBCoverage
|0 StatID:(DE-HGF)0150
|2 StatID
|b Web of Science Core Collection
915 _ _ |a DBCoverage
|0 StatID:(DE-HGF)0199
|2 StatID
|b Thomson Reuters Master Journal List
915 _ _ |a DBCoverage
|0 StatID:(DE-HGF)0200
|2 StatID
|b SCOPUS
915 _ _ |a DBCoverage
|0 StatID:(DE-HGF)0300
|2 StatID
|b Medline
915 _ _ |a Nationallizenz
|0 StatID:(DE-HGF)0420
|2 StatID
915 _ _ |a DBCoverage
|0 StatID:(DE-HGF)1030
|2 StatID
|b Current Contents - Life Sciences
920 _ _ |l yes
920 1 _ |0 I:(DE-Juel1)PGI-9-20110106
|k PGI-9
|l Halbleiter-Nanoelektronik
|x 0
920 1 _ |0 I:(DE-Juel1)PGI-5-20110106
|k PGI-5
|l Mikrostrukturforschung
|x 1
920 1 _ |0 I:(DE-Juel1)ZEA-3-20090406
|k ZEA-3
|l Analytik
|x 2
980 _ _ |a journal
980 _ _ |a VDB
980 _ _ |a UNRESTRICTED
980 _ _ |a I:(DE-Juel1)PGI-9-20110106
980 _ _ |a I:(DE-Juel1)PGI-5-20110106
980 _ _ |a I:(DE-Juel1)ZEA-3-20090406
981 _ _ |a I:(DE-Juel1)ER-C-1-20170209
981 _ _ |a I:(DE-Juel1)PGI-5-20110106
981 _ _ |a I:(DE-Juel1)ZEA-3-20090406


LibraryCollectionCLSMajorCLSMinorLanguageAuthor
Marc 21