%0 Conference Paper
%A Arutinov, D.
%A Barbero, M.
%A Breugnon, P.
%A Chantepie, B.
%A Clemens, J. C.
%A Fei, R.
%A Fougeron, D.
%A Garcia-Sciveres, M.
%A Godiot, S.
%A Hemperek, T.
%A Karagounis, M.
%A Kruger, H.
%A Mekkaoui, A.
%A Perrot, L.
%A Rozanov, A.
%A Wermes, N.
%A Pangaud, P.
%T A Tezzaron-Chartered 3D-IC electronic for SLHC/ATLAS hybrid pixels detectors test results and irradiations performance
%I IEEE
%M FZJ-2013-03207
%@ 978-1-4673-0118-3
%P 682 - 684
%D 2011
%X The ATLAS pixel collaboration has started in 2008 a R&D program to use the latest advances in 3-D electronics technology in order to develop a new Front-End (FE) chip for a vertex detector for High Energy Physics (HEP). This program using the commercial Tezzaron-Chartered 0.13μm LP technology should be able to fulfill the requirements imposed by the ten times higher luminosity given by the High Luminosity LHC accelerator. The FE-TC4-P1 is a hybrid pixel read-out chip realized by the first MPW for HEP. This three dimensional chip includes an analog part called FE-TC4-AE and two digital parts called FE-TC4-DS and FE-TC4-DC. At the same time, several prototypes were realized in Chartered 0.13μm LP technology, in order to disentangle from effects induced by 3D architecture. These FE-C4-P1,2,3 prototypes have proved a good radiation hardness up to 400Mrads as well as good performances. This paper presents results from the FE-TC4-P1 chip which has been recently tested and irradiated.
%B 2011 IEEE Nuclear Science Symposium and Medical Imaging Conference (2011 NSS/MIC)
%C 23 Oct 2011 - 29 Oct 2011, Valencia (Spain)
Y2 23 Oct 2011 - 29 Oct 2011
M2 Valencia, Spain
%F PUB:(DE-HGF)8
%9 Contribution to a conference proceedings
%R 10.1109/NSSMIC.2011.6154082
%U https://juser.fz-juelich.de/record/135251