000135251 001__ 135251
000135251 005__ 20250129092433.0
000135251 020__ $$a978-1-4673-0118-3
000135251 0247_ $$2doi$$a10.1109/NSSMIC.2011.6154082
000135251 037__ $$aFZJ-2013-03207
000135251 041__ $$aEnglish
000135251 1001_ $$0P:(DE-HGF)0$$aArutinov, D.$$b0
000135251 1112_ $$0Conf-20111023_Valencia_Spain$$a2011 IEEE Nuclear Science Symposium and Medical Imaging Conference (2011 NSS/MIC)$$cValencia$$d2011-10-23 - 2011-10-29$$gNSS/MIC 2011$$p2011 IEEE Nuclear Science Symposium Conference Record$$wSpain
000135251 245__ $$aA Tezzaron-Chartered 3D-IC electronic for SLHC/ATLAS hybrid pixels detectors test results and irradiations performance
000135251 260__ $$bIEEE$$c2011
000135251 300__ $$a682 - 684
000135251 3367_ $$0PUB:(DE-HGF)8$$2PUB:(DE-HGF)$$aContribution to a conference proceedings$$bcontrib$$mcontrib$$s1375713340_28269
000135251 3367_ $$033$$2EndNote$$aConference Paper
000135251 3367_ $$2ORCID$$aCONFERENCE_PAPER
000135251 3367_ $$2DataCite$$aOutput Types/Conference Paper
000135251 3367_ $$2DRIVER$$aconferenceObject
000135251 3367_ $$2BibTeX$$aINPROCEEDINGS
000135251 500__ $$3POF3_Assignment on 2016-02-29
000135251 520__ $$aThe ATLAS pixel collaboration has started in 2008 a R&D program to use the latest advances in 3-D electronics technology in order to develop a new Front-End (FE) chip for a vertex detector for High Energy Physics (HEP). This program using the commercial Tezzaron-Chartered 0.13μm LP technology should be able to fulfill the requirements imposed by the ten times higher luminosity given by the High Luminosity LHC accelerator. The FE-TC4-P1 is a hybrid pixel read-out chip realized by the first MPW for HEP. This three dimensional chip includes an analog part called FE-TC4-AE and two digital parts called FE-TC4-DS and FE-TC4-DC. At the same time, several prototypes were realized in Chartered 0.13μm LP technology, in order to disentangle from effects induced by 3D architecture. These FE-C4-P1,2,3 prototypes have proved a good radiation hardness up to 400Mrads as well as good performances. This paper presents results from the FE-TC4-P1 chip which has been recently tested and irradiated.
000135251 536__ $$0G:(DE-HGF)POF2-899$$a899 - ohne Topic (POF2-899)$$cPOF2-899$$fPOF I$$x0
000135251 588__ $$aDataset connected to CrossRef Conference
000135251 7001_ $$0P:(DE-HGF)0$$aBarbero, M.$$b1
000135251 7001_ $$0P:(DE-HGF)0$$aBreugnon, P.$$b2
000135251 7001_ $$0P:(DE-HGF)0$$aChantepie, B.$$b3
000135251 7001_ $$0P:(DE-HGF)0$$aClemens, J. C.$$b4
000135251 7001_ $$0P:(DE-HGF)0$$aFei, R.$$b5
000135251 7001_ $$0P:(DE-HGF)0$$aFougeron, D.$$b6
000135251 7001_ $$0P:(DE-HGF)0$$aGarcia-Sciveres, M.$$b7
000135251 7001_ $$0P:(DE-HGF)0$$aGodiot, S.$$b8
000135251 7001_ $$0P:(DE-HGF)0$$aHemperek, T.$$b9
000135251 7001_ $$0P:(DE-HGF)0$$aKaragounis, M.$$b10
000135251 7001_ $$0P:(DE-HGF)0$$aKruger, H.$$b11
000135251 7001_ $$0P:(DE-Juel1)VDB89362$$aMekkaoui, A.$$b12
000135251 7001_ $$0P:(DE-HGF)0$$aPerrot, L.$$b13
000135251 7001_ $$0P:(DE-HGF)0$$aRozanov, A.$$b14
000135251 7001_ $$0P:(DE-HGF)0$$aWermes, N.$$b15
000135251 7001_ $$0P:(DE-HGF)0$$aPangaud, P.$$b16$$eCorresponding author
000135251 773__ $$a10.1109/NSSMIC.2011.6154082
000135251 8564_ $$uhttp://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6154082
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000135251 9141_ $$y2013
000135251 920__ $$lyes
000135251 9201_ $$0I:(DE-Juel1)ZEA-2-20090406$$kZEA-2$$lZentralinstitut für Elektronik$$x0
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