TY  - CONF
AU  - Arutinov, D.
AU  - Barbero, M.
AU  - Breugnon, P.
AU  - Chantepie, B.
AU  - Clemens, J. C.
AU  - Fei, R.
AU  - Fougeron, D.
AU  - Garcia-Sciveres, M.
AU  - Godiot, S.
AU  - Hemperek, T.
AU  - Karagounis, M.
AU  - Kruger, H.
AU  - Mekkaoui, A.
AU  - Perrot, L.
AU  - Rozanov, A.
AU  - Wermes, N.
AU  - Pangaud, P.
TI  - A Tezzaron-Chartered 3D-IC electronic for SLHC/ATLAS hybrid pixels detectors test results and irradiations performance
PB  - IEEE
M1  - FZJ-2013-03207
SN  - 978-1-4673-0118-3
SP  - 682 - 684
PY  - 2011
AB  - The ATLAS pixel collaboration has started in 2008 a R&D program to use the latest advances in 3-D electronics technology in order to develop a new Front-End (FE) chip for a vertex detector for High Energy Physics (HEP). This program using the commercial Tezzaron-Chartered 0.13μm LP technology should be able to fulfill the requirements imposed by the ten times higher luminosity given by the High Luminosity LHC accelerator. The FE-TC4-P1 is a hybrid pixel read-out chip realized by the first MPW for HEP. This three dimensional chip includes an analog part called FE-TC4-AE and two digital parts called FE-TC4-DS and FE-TC4-DC. At the same time, several prototypes were realized in Chartered 0.13μm LP technology, in order to disentangle from effects induced by 3D architecture. These FE-C4-P1,2,3 prototypes have proved a good radiation hardness up to 400Mrads as well as good performances. This paper presents results from the FE-TC4-P1 chip which has been recently tested and irradiated.
T2  - 2011 IEEE Nuclear Science Symposium and Medical Imaging Conference (2011 NSS/MIC)
CY  - 23 Oct 2011 - 29 Oct 2011, Valencia (Spain)
Y2  - 23 Oct 2011 - 29 Oct 2011
M2  - Valencia, Spain
LB  - PUB:(DE-HGF)8
DO  - DOI:10.1109/NSSMIC.2011.6154082
UR  - https://juser.fz-juelich.de/record/135251
ER  -