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@INPROCEEDINGS{Arutinov:135251,
      author       = {Arutinov, D. and Barbero, M. and Breugnon, P. and
                      Chantepie, B. and Clemens, J. C. and Fei, R. and Fougeron,
                      D. and Garcia-Sciveres, M. and Godiot, S. and Hemperek, T.
                      and Karagounis, M. and Kruger, H. and Mekkaoui, A. and
                      Perrot, L. and Rozanov, A. and Wermes, N. and Pangaud, P.},
      title        = {{A} {T}ezzaron-{C}hartered 3{D}-{IC} electronic for
                      {SLHC}/{ATLAS} hybrid pixels detectors test results and
                      irradiations performance},
      publisher    = {IEEE},
      reportid     = {FZJ-2013-03207},
      isbn         = {978-1-4673-0118-3},
      pages        = {682 - 684},
      year         = {2011},
      abstract     = {The ATLAS pixel collaboration has started in 2008 a $R\&D$
                      program to use the latest advances in 3-D electronics
                      technology in order to develop a new Front-End (FE) chip for
                      a vertex detector for High Energy Physics (HEP). This
                      program using the commercial Tezzaron-Chartered 0.13μm LP
                      technology should be able to fulfill the requirements
                      imposed by the ten times higher luminosity given by the High
                      Luminosity LHC accelerator. The FE-TC4-P1 is a hybrid pixel
                      read-out chip realized by the first MPW for HEP. This three
                      dimensional chip includes an analog part called FE-TC4-AE
                      and two digital parts called FE-TC4-DS and FE-TC4-DC. At the
                      same time, several prototypes were realized in Chartered
                      0.13μm LP technology, in order to disentangle from effects
                      induced by 3D architecture. These FE-C4-P1,2,3 prototypes
                      have proved a good radiation hardness up to 400Mrads as well
                      as good performances. This paper presents results from the
                      FE-TC4-P1 chip which has been recently tested and
                      irradiated.},
      month         = {Oct},
      date          = {2011-10-23},
      organization  = {2011 IEEE Nuclear Science Symposium
                       and Medical Imaging Conference (2011
                       NSS/MIC), Valencia (Spain), 23 Oct 2011
                       - 29 Oct 2011},
      cin          = {ZEA-2},
      cid          = {I:(DE-Juel1)ZEA-2-20090406},
      pnm          = {899 - ohne Topic (POF2-899)},
      pid          = {G:(DE-HGF)POF2-899},
      typ          = {PUB:(DE-HGF)8},
      doi          = {10.1109/NSSMIC.2011.6154082},
      url          = {https://juser.fz-juelich.de/record/135251},
}