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024 7 _ |a 10.1109/NSSMIC.2011.6154082
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041 _ _ |a English
100 1 _ |a Arutinov, D.
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111 2 _ |a 2011 IEEE Nuclear Science Symposium and Medical Imaging Conference (2011 NSS/MIC)
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|d 2011-10-23 - 2011-10-29
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245 _ _ |a A Tezzaron-Chartered 3D-IC electronic for SLHC/ATLAS hybrid pixels detectors test results and irradiations performance
260 _ _ |c 2011
|b IEEE
300 _ _ |a 682 - 684
336 7 _ |a Contribution to a conference proceedings
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336 7 _ |a Conference Paper
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520 _ _ |a The ATLAS pixel collaboration has started in 2008 a R&D program to use the latest advances in 3-D electronics technology in order to develop a new Front-End (FE) chip for a vertex detector for High Energy Physics (HEP). This program using the commercial Tezzaron-Chartered 0.13μm LP technology should be able to fulfill the requirements imposed by the ten times higher luminosity given by the High Luminosity LHC accelerator. The FE-TC4-P1 is a hybrid pixel read-out chip realized by the first MPW for HEP. This three dimensional chip includes an analog part called FE-TC4-AE and two digital parts called FE-TC4-DS and FE-TC4-DC. At the same time, several prototypes were realized in Chartered 0.13μm LP technology, in order to disentangle from effects induced by 3D architecture. These FE-C4-P1,2,3 prototypes have proved a good radiation hardness up to 400Mrads as well as good performances. This paper presents results from the FE-TC4-P1 chip which has been recently tested and irradiated.
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700 1 _ |a Barbero, M.
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700 1 _ |a Breugnon, P.
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700 1 _ |a Chantepie, B.
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700 1 _ |a Clemens, J. C.
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700 1 _ |a Fei, R.
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700 1 _ |a Fougeron, D.
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700 1 _ |a Garcia-Sciveres, M.
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700 1 _ |a Godiot, S.
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700 1 _ |a Hemperek, T.
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700 1 _ |a Karagounis, M.
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700 1 _ |a Kruger, H.
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700 1 _ |a Mekkaoui, A.
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700 1 _ |a Perrot, L.
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700 1 _ |a Rozanov, A.
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700 1 _ |a Wermes, N.
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700 1 _ |a Pangaud, P.
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|e Corresponding author
773 _ _ |a 10.1109/NSSMIC.2011.6154082
856 4 _ |u http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6154082
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