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024 7 _ |a 10.7567/JJAP.52.08JN02
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037 _ _ |a FZJ-2013-04433
082 _ _ |a 530
100 1 _ |a Yang, Shu
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245 _ _ |a Enhancement-Mode LaLuO3–AlGaN/GaN Metal–Insulator–Semiconductor High-Electron-Mobility Transistors Using Fluorine Plasma Ion Implantation
260 _ _ |a Tokyo
|c 2013
|b Inst. of Pure and Applied Physics
336 7 _ |a Journal Article
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520 _ _ |a In this work, enhancement-mode (E-mode) AlGaN/GaN metal–insulator–semiconductor high-electron-mobility transistors (MIS-HEMTs) with high-κ LaLuO3 (LLO) gate dielectric were fabricated by deploying the CF4 plasma treatment technique in a gate-dielectric-first planar process. CF4 plasma treatment can shift the threshold voltage from -2.3 V [for depletion-mode (D-mode) LLO MIS-HEMTs] to 0.6 V (for E-mode LLO MIS-HEMTs). Transmission electron microscopy (TEM) and X-ray photoelectron spectroscopy (XPS) results suggest that fluorine ions could penetrate through the polycrystalline/amorphous LLO film and be implanted into the (Al)GaN barrier layer. The primary threshold voltage (VTH) shift mechanism of the E-mode LLO MIS-HEMTs is the negatively-charged fluorine ions in (Al)GaN, while fluorine atoms form chemical bonds with La/Lu atoms in the fluorinated LLO film. The E-mode LLO MIS-HEMTs exhibit a drive drain current density of 352 mA/mm at VGS = 2.5 V and a peak transconductance (Gm) of ∼193 mS/mm. Significant suppression of current collapse and low dynamic ON-resistance are obtained in the E-mode LLO MIS-HEMTs under high-drain-bias switching conditions.
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700 1 _ |a Huang, Sen
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700 1 _ |a Schnee, Michael
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700 1 _ |a Zhao, Qing-Tai
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700 1 _ |a Schubert, Jürgen
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700 1 _ |a Chen, Kevin J.
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773 _ _ |a 10.7567/JJAP.52.08JN02
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