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@ARTICLE{Raissi:16157,
author = {Raissi, M. and Regula, G. and Hadj Belgacem, C. and Rochdi,
N. and Bozzo-Escoubas, S. and Coudreau, C. and Holländer,
B. and Fnaiech, M. and D'Avitaya, F.A. and Lazzari, J.-L.},
title = {{D}ifferent architectures of relaxed {S}i1-x{G}e/{S}i
preudo-substrates grown by low-pressure chemical vapor
deposition: {S}tructural and morphological characteristics},
journal = {Journal of crystal growth},
volume = {328},
issn = {0022-0248},
address = {Amsterdam [u.a.]},
publisher = {Elsevier},
reportid = {PreJuSER-16157},
pages = {18-24},
year = {2011},
note = {Record converted from VDB: 12.11.2012},
abstract = {A detailed characterization of SiGe thin layers grown by
low-pressure chemical vapor deposition (LP-CVD) on different
types of Si buffer layers (BLs) is presented. Using the same
conditions of SiGe growth, Si BLs were elaborated in
ultra-high vacuum conditions at low (575 degrees C) and
medium (700 degrees C) temperatures to improve the
crystalline quality of the Si buffer layer. Using both types
of Si BLs, the SiGe layer exhibits a very high density of
dislocations (> 10(5) cm(-2)). Here, we proposed to create a
ductile area in the Si BL, before the SiGe deposition. It
consists of nanocavities located at about 100 nm under the
Si BL surface and obtained by He+ implantation at 10 key and
at room temperature with fluencies of 5 x 10(15) ions cm(-2)
or 5 x 10(16) ions cm(-2). The creation of the nanocavity
layer is enabled by an annealing step at 700 degrees C for
one hour. These kinds of Si BLs were studied by cross
section transmission electron microscopy, X-ray diffraction,
Rutherford backscattering, photoluminescence, atomic force
and optical microscopy before and after revealing the
dislocations by the chemical etching of SiGe layers. From
these analyses, we evidenced the blocking of threading
dislocations by the formation of loops located between the
region of nanocavities formed in the substrate and the
SiGe/Si interface. This method allows to strongly enhance
the relaxation rate $(97\%)$ of SiGe layers, and to improve
their crystalline and morphological quality for their use
for high-speed microelectronic and optoelectronic devices
for which the surface roughness and the threading
dislocation density are key issues. (C) 2011 Elsevier B.V.
All rights reserved.},
keywords = {J (WoSType)},
cin = {PGI-9 / JARA-FIT},
ddc = {540},
cid = {I:(DE-Juel1)PGI-9-20110106 / $I:(DE-82)080009_20140620$},
pnm = {Grundlagen für zukünftige Informationstechnologien},
pid = {G:(DE-Juel1)FUEK412},
shelfmark = {Crystallography / Materials Science, Multidisciplinary /
Physics, Applied},
typ = {PUB:(DE-HGF)16},
UT = {WOS:000293725900004},
doi = {10.1016/j.jcrysgro.2011.06.035},
url = {https://juser.fz-juelich.de/record/16157},
}