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@INPROCEEDINGS{Fox:172043,
author = {Fox, Alfred and Mikulics, Martin and Hardtdegen, Hilde and
Trellenkamp, Stefan and Arango, Y. C. and Grützmacher,
Detlev and Sofer, Z. and Greusova, D. and Novak, J. and
Kordos, P. and Marso, M.},
title = {{N}ovel {D}ouple-{L}evel-{T}-{G}ate {T}echnology},
address = {Danver, MA 01923},
publisher = {IEEE},
reportid = {FZJ-2014-05592},
isbn = {978-1-4799-5474-2},
pages = {89-92},
year = {2014},
comment = {The 10the International Conference on Advanced
Semiconductor Devices and Microsystems},
booktitle = {The 10the International Conference on
Advanced Semiconductor Devices and
Microsystems},
abstract = {We developed a novel double-level-T-gate technology based
on wet etching of a metal gate interlayer. With the help of
this technological process we prepared T-gate feet with
widths as small as 200 nm. The major advantage of our
process is its use of only standard optical lithography. It
allows the fabrication of 100 nanometer size T-gates for
transistors. High electron mobility transistors (HEMTs) were
fabricated on an AlGaN/GaN/sapphire material structure with
an original gate length Lg of 2 µm. Their cutoff frequency
of 6 GHz was improved to 60 GHz by etching the gate to a 200
nm length double T-gate contact.},
month = {Oct},
date = {2014-10-20},
organization = {ASDAM 2014, Smolenice (Slovakia), 20
Oct 2014 - 22 Oct 2014},
cin = {PGI-9},
cid = {I:(DE-Juel1)PGI-9-20110106},
pnm = {421 - Frontiers of charge based Electronics (POF2-421)},
pid = {G:(DE-HGF)POF2-421},
experiment = {EXP:(DE-MLZ)DEL-20140101},
typ = {PUB:(DE-HGF)8 / PUB:(DE-HGF)7},
url = {https://juser.fz-juelich.de/record/172043},
}