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@INPROCEEDINGS{Marso:172046,
author = {Marso, M. and Mikulics, Martin and Winden, W. and Arango,
Y. C. and Schäfer, Anna and Sofer, Z. and Grützmacher,
Detlev and Hardtdegen, Hilde},
title = {{I}n{G}a{N} nano-{LED}s for energy saving optoelectronics},
address = {Danver, MA 01923},
publisher = {IEEE},
reportid = {FZJ-2014-05595},
isbn = {978-1-4799-54759},
pages = {315-318},
year = {2014},
abstract = {Vertically integrated III-nitride nano-LEDs designed for
operation in thetelecommunication-wavelength range were
fabricated and tested in the (p-GaN/InGaN/n-GaN/sapphire)
material system. We found that the band edgeluminescence
energy of the nano-LEDs could be engineered by their size
andby the strain interaction with the masked SiO2/GaN
substrates; it dependslinearly on the structure size. The
results of reliability measurements provethat our
technological process is perfectly suited for long-term
operation ofthe LEDs without any indication of degradation
effects. The presentedtechnology shows strong potential for
future low energy consumptionoptoelectronics.1.
IntroductionSingle photon emitters based on InGaN nano-LEDs
(light emitting diodes) operating atroom temperature are the
key to enable future low energy consumption, highly secure
andultrafast optoelectronics [1]. There is an especially
strong need to develop such emittingsources at the
wavelengths used for telecommunication, which are fully
compatible withestablished communication systems. Major
challenges are the whole nano-LED integrationtechnology and
especially the contacts. The top contact should be highly
electricallyconductive, highly optically transparent,
thermally and mechanically stable and simple tofabricate.2.
Device fabricationFirst, we started with the site-controlled
growth of InGaN nanostructures via
catalystfreeselective-area MOVPE [2]. The manufacturing
process was optimized with respect to themask pattern in
order to be able to fabricate individually addressable InGaN
nanopyramidbased nano-LEDs. The starting point for growth
were uniform and smooth n-GaN layers of atleast 1.3μm on
sapphire (c-plane) masked with SiO2. Afterwards a
hexagonally arranged arrayof openings was defined by
electron beam lithography followed by reactive ion etching
(RIE)with trifluoromethane (CHF3) gas. The separation
distance was fixed to 3μm and the bottomhole diameter was
varied from 20 nm to 100 nm. All samples were grown by MOVPE
in anAIX 200/4 RF-S horizontal flow reactor (AIXTRON). The
growth parameters were tunedwith respect to the highest
possible selectivity. After this optimization, the growth
time was978-1-},
month = {Oct},
date = {2014-10-20},
organization = {ASDAM 2014, Smolenice (Slovakia), 20
Oct 2014 - 22 Oct 2014},
cin = {PGI-9},
cid = {I:(DE-Juel1)PGI-9-20110106},
pnm = {421 - Frontiers of charge based Electronics (POF2-421)},
pid = {G:(DE-HGF)POF2-421},
experiment = {EXP:(DE-MLZ)DEL-20140101},
typ = {PUB:(DE-HGF)8},
url = {https://juser.fz-juelich.de/record/172046},
}