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@ARTICLE{Kim:18247,
author = {Kim, S.K. and Hoffmann-Eifert, S. and Reiner, M. and Waser,
R.},
title = {{R}elation between enhancement in growth and
thickness-dependent crystallization in {ALD} {T}i{O}2 thin
films},
journal = {Journal of the Electrochemical Society},
volume = {158},
issn = {0013-4651},
address = {Pennington, NJ},
publisher = {Electrochemical Society},
reportid = {PreJuSER-18247},
pages = {D6 - D9},
year = {2011},
note = {The authors thank Dr. U. Breuer for XRF analysis, Dr. S. Mi
for HRTEM analysis, Dr. M. Muller for support with contact
angle measurements, and M. Gebauer, M. Gerst, and H. John
for technical support. One of the authors (S. K. Kim)
acknowledges Alexander von Humboldt Stiftung (AvH) for
awarding him a research fellowship.},
abstract = {TiO2 films were grown by atomic layer deposition (ALD) with
Ti(O-i-Pr)(4) and H2O. Below a critical film thickness the
grown TiO2 films exhibited an amorphous structure. The
growth rate of the amorphous films was constant at about
0.055 nm/cycle irrespective of the susceptor temperature.
Films which exceeded the critical thickness showed a
polycrystalline structure. The growth rate of the thicker
crystallized films was higher by a factor of about 2
compared to the value of the thin amorphous films. In this
study it is shown that the abrupt increase in the growth
rate is caused by an increase in the density of hydroxyl
groups on the reaction surface rather than by a certain
surface roughening accompanying the crystallization process.
(c) 2010 The Electrochemical Society. [DOI:
10.1149/1.3507258] All rights reserved.},
keywords = {J (WoSType)},
cin = {PGI-7 / JARA-FIT},
ddc = {540},
cid = {I:(DE-Juel1)PGI-7-20110106 / $I:(DE-82)080009_20140620$},
pnm = {Grundlagen für zukünftige Informationstechnologien},
pid = {G:(DE-Juel1)FUEK412},
shelfmark = {Electrochemistry / Materials Science, Coatings $\&$ Films},
typ = {PUB:(DE-HGF)16},
UT = {WOS:000284697900028},
doi = {10.1149/1.3507258},
url = {https://juser.fz-juelich.de/record/18247},
}