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@ARTICLE{Tappertzhofen:18272,
author = {Tappertzhofen, S. and Menzel, S. and Valov, I. and Waser,
R.},
title = {{R}edox {P}rocesses in {S}ilicon {D}ioxide {T}hin {F}ilms
using {C}opper {M}icroelectrodes},
journal = {Applied physics letters},
volume = {99},
issn = {0003-6951},
address = {Melville, NY},
publisher = {American Institute of Physics},
reportid = {PreJuSER-18272},
pages = {203103},
year = {2011},
note = {Record converted from VDB: 12.11.2012},
abstract = {Although SiO2 is a typical insulator, we demonstrate an
electrochemical characteristic of the Cu/Cu+ oxidation at
the interface with 30 nm thick silicon dioxide thin films
studied by cyclic voltammetry. This study reveals the
process of anodic oxidation and subsequent reduction of
oxidized Cu ions injected in the SiO2 layer with special
attention to the kinetics of the redox process. We estimated
the diffusion coefficient and the mobility of Cu ions in
SiO2. The results gain deeper insight in the processes
involved during resistive switching of Cu/SiO2 based
nonvolatile memory devices. (C) 2011 American Institute of
Physics. [doi:10.1063/1.3662013]},
keywords = {J (WoSType)},
cin = {JARA-FIT / PGI-7},
ddc = {530},
cid = {$I:(DE-82)080009_20140620$ / I:(DE-Juel1)PGI-7-20110106},
pnm = {Grundlagen für zukünftige Informationstechnologien},
pid = {G:(DE-Juel1)FUEK412},
shelfmark = {Physics, Applied},
typ = {PUB:(DE-HGF)16},
UT = {WOS:000297786500052},
doi = {10.1063/1.3662013},
url = {https://juser.fz-juelich.de/record/18272},
}