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@PHDTHESIS{Richter:187187,
author = {Richter, Simon},
title = {{S}trained {S}ilicon and {S}ilicon-{G}ermanium {N}anowire
{T}unnel {FET}s and {I}nverters},
volume = {40},
school = {RWTH Aachen},
type = {Dissertation},
address = {Jülich},
publisher = {Forschungszentrum Jülich GmbH Zentralbibliothek, Verlag},
reportid = {FZJ-2015-00861},
isbn = {978-3-95806-002-9},
series = {Schriften des Forschungszentrums Jülich. Reihe Information
/ information},
pages = {iii, 117 S.},
year = {2014},
note = {Dissertation, RWTH Aachen, 2014},
abstract = {Reducing power consumption is an important issue for
integrated circuits in portable devices relying on batteries
and systems without external power supply. Scaling of the
supply voltage V$_{DD}$ in integrated circuits is a powerful
tool for reducing the power consumption, due to the
quadratic dependence on V$_{DD}$. MOSFETs, however, exhibit
a fundamental limitation forthe drain current increase per
applied gate voltage difference. The tunnel field-effect
transistor(TFET) provides the ability for beating this
limitation, thus offering a performanceadvantage over
MOSFETs for ultra-low V$_{DD}$. In this work, TFETs are
fabricated with respect to design rules deduced from basic
physical relations for the tunneling probability. The aim is
to increase the tunneling probability in order to obtain
higher drive currents in the devices. A tri-gated nanowire
design in combinationwith a high-$\ κappa$/metal gate
stacks is employed in order to increase the electrostatic
gate control. Devices are fabricated on tensile-strained Si
on insulator (SSOI) as well as compressively strained SiGe
on SOI substrates. Fabricated devices reveal enhanced
current for smaller band gap and effective carrier mass in
those materials. In order to further increase I$_{ON}$ and
prevent I$_{OFF}$ degradation occurring in small band gap
TFET homostructures, a NW based heterostructure design with
enlarged tunnel junction area is conceived and fabricated.
Device characterization of this structure reveals superior
performance and large I$_{ON}$/I$_{OFF}$ ratio. TCAD
simulations demonstrate how the structure could be adapted
toutilize line tunneling in an inverted source region for
further current improvement. SSOI NW TFET characteristics
are investigated and compared to MOSFETs fabricated with
analog processing. Temperature dependence of TFET
characteristics is analyzed and hot carrier effects in the
tunnel junction are revealed by charge pumping measurements.
Furthermore, the feasibility of TFETs for logic application
is studied by fabrication of inverter structures. A
comparison of TFET and MOSFET inverters reveals degradation
of the voltage transfer characteristics caused by the
ambipolarity of TFETs. An emulated TFET structure based on
the fabricated SiGe/Si heterostructure with reduced
ambipolarity provesto prevent output degradation of the TFET
inverter and demonstrates sufficiently high noisemargins
down to ultra-low supply voltages. Low frequency noise
measurements are performed on SSOI NW TFETs and MOSFETs
revealinga dominant noise contribution by the tunnel
junction in TFETs. The confined tunnel junction area
provides a higher probability for RTS noise generation.},
keywords = {Dissertation (GND)},
cin = {PGI-9},
cid = {I:(DE-Juel1)PGI-9-20110106},
pnm = {421 - Frontiers of charge based Electronics (POF2-421)},
pid = {G:(DE-HGF)POF2-421},
typ = {PUB:(DE-HGF)3 / PUB:(DE-HGF)11},
url = {https://juser.fz-juelich.de/record/187187},
}