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@PHDTHESIS{Lentz:187988,
author = {Lentz, Florian},
title = {{I}ntegration of {R}edox-based {R}esistive {S}witching
{M}emory {D}evices},
volume = {41},
school = {RWTH Aachen},
type = {Dr.},
address = {Jülich},
publisher = {Forschungszentrum Jülich GmbH Zentralbibliothek, Verlag},
reportid = {FZJ-2015-01477},
isbn = {978-3-95806-019-7},
series = {Schriften des Forschungszentrums Jülich. Reihe Information
/ Information},
pages = {166 S.},
year = {2015},
note = {RWTH Aachen, Diss., 2014},
abstract = {The steadily growing market for consumer electronics and
the rapid proliferation of mobile devices such as tablet
computers, MP3 players and smart phones make high demands
for the nonvolatile memory. Present FLASH memory technology
approaches to the end due to physical scalability limits.
Therefore, an alternative technology must be developed. For
memory technology, not only the storage density and cost are
important factors but the power consumption and the
writing/reading speed must also be taken in account.
Redox-based resistive memory (ReRAM) offers a potential
alternative to the FLASH technology and presently is in the
focus of research activities. The operating principle of the
ReRAM is based on the non-volatile reversible change in
resistance by electrical stimuli in a simple
metal-insulator-metal(MIM) device architecture. This simple
structure enables the integration of ReRAM in passive
crossbar arrays, in which each crosspoint consumes only
4F$^{2}$ (F- feature size) device area. This leads to an
ultra-high storage density at reduced cost. Research on the
ReRAM memory elements requires a technology platform that
ensures a cost-effective fabrication of the crossbar devices
with nanometer feature size. In this thesis, the fabrication
processes have been developed based on the nanoimprint
lithography, which facilitates both the high resolution
(<50nm) and the high throughput at low cost. The stamp for
the UV-nanoimprinting is developed with plasma etching and
electron-beam lithography. This process facilitates the
fabrication of the ReRAM devices sizes ranging from 40x40
nm$^{2}$ to 100x100 nm$^{2}$. The fabricated nano-crosspoint
ReRAM of different switching layer thickness and different
device areas are electrically characterized. In order to
toggle the resistance state in the ReRAM device, an
electroforming step is generally required. In this work, a
systematic analysis of the electroforming process is carried
out on TiO$_{2}$ and WO$_{3}$-based ReRAM cells and the
respective switching characteristics are investigated. The
switching mechanism is explained by the filamentary
conduction model. The forming voltage decreases with
decreasing oxide layer thickness whereas it increases for
the smaller device size. Due to overshoot phenomena during
the electroforming process, these devices show a significant
increased switching current, lower non-linearity, and lower
endurance. The ReRAM device performance is improved by
integration in the backend of a 65nm CMOS process. In the
integrated 1T-1R stack, the electroforming is performed by
controlling the current flow with the gate electrode. By
employing this approach, the switching current in the ReRAM
devices is reduced to 1 $\mu$A. In order to lower the sneak
path current in the passive crossbar arrays, a high degree
of nonlinearity is required. This nonlinearity parameter has
been investigated with 100ns transient pulses in the
nano-crossbar devices and in the 1T-1R structures. This
parameter depends on the switching current and switching
material properties. The lower switching current in the
TiO$_{2}$ ReRAM leads to the higher nonlinearity.
Furthermore, the ReRAM nanodevices inherently exhibit open
clamp voltage in the switching characteristics. This
phenomenon is explained by the electromotive force(EMF). The
amplitude of the generated EMF voltage depends on the nature
of the switching materials and can be several hundred mV.
This degrades the conducting filament and thereby limits the
ON state retention properties of the ReRAM devices.
Additionally, the non-zero crossing of the I-V
characteristics, caused by the EMF voltage demands the
refinement of the memristor theory.},
keywords = {Dissertation (GND)},
cin = {PGI-7},
cid = {I:(DE-Juel1)PGI-7-20110106},
pnm = {521 - Controlling Electron Charge-Based Phenomena
(POF3-521)},
pid = {G:(DE-HGF)POF3-521},
typ = {PUB:(DE-HGF)11},
url = {https://juser.fz-juelich.de/record/187988},
}