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@ARTICLE{Wirtz:201785,
author = {Wirtz, M. and Linke, J. and Pintsuk, G. and Singheiser, L.
and Uytdenhouwen, I.},
title = {{C}omparison of the thermal shock performance of different
tungsten grades and the influence of microstructure on the
damage behaviour},
journal = {Physica scripta},
volume = {T145},
issn = {1402-4896},
address = {Bristol},
publisher = {IoP Publ.},
reportid = {FZJ-2015-04079},
pages = {014058 -},
year = {2011},
abstract = {The thermal shock performances of two new tungsten grades
with 1 and $5 wt\%$ of tantalum were characterized with
the electron beam facility JUDITH 1. As a reference
material, ultra-high-purity tungsten (W-UHP) with a purity
of $99.9999 wt\%$ was used. The induced thermal shock
crack networks and surface modifications were analysed by a
scanning electron microscope, light microscopy and laser
profilometry. Damage and cracking thresholds were defined
for all materials as a function of absorbed power density
and base temperature. The materials showed significantly
different thermal shock behaviour, which is, among others,
expressed by differences in cracking patterns, i.e. crack
distance and depth. These results allow us to quantify the
influence of the materials' mechanical and thermal
properties on the thermal shock performance. Furthermore,
the specific grain structure of the materials has a
significant influence on crack propagation towards the bulk
material.},
cin = {IEK-2 / N-M},
ddc = {530},
cid = {I:(DE-Juel1)IEK-2-20101013 / I:(DE-Juel1)N-M-20100415},
pnm = {135 - Plasma-wall interactions (POF2-135)},
pid = {G:(DE-HGF)POF2-135},
typ = {PUB:(DE-HGF)16},
UT = {WOS:000298475200059},
doi = {10.1088/0031-8949/2011/T145/014058},
url = {https://juser.fz-juelich.de/record/201785},
}