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@PHDTHESIS{Weng:202769,
author = {Weng, Robert},
title = {{S}tudy on the electroforming and resistive switching
behaviour of nickel oxide thin films for non-volatile memory
applications},
volume = {109},
school = {RWTH Aachen},
type = {Dr.},
address = {Jülich},
publisher = {Forschungszentrum Jülich GmbH Zentralbibliothek, Verlag},
reportid = {FZJ-2015-04951},
isbn = {978-3-95806-062-3},
series = {Schriften des Forschungszentrums Jülich. Reihe
Schlüsseltechnologien / Key Technologies},
pages = {XXI, 159 S.},
year = {2015},
note = {RWTH Aachen, Diss., 2015},
abstract = {Over the past decade, the resistance switching effect has
drawn attention within the scientific community as a
potential candidate for non-volatile random access memories
(RAM) and crossbar logic concepts. The resistance switching
memory cells are based on (at least) two well-defined
non-volatile resistance states, e.g., high resistance state
(HRS) and low resistance state (LRS), that define two (or
more) logic memory states, e.g., 1 or 0. Often these cells
have a simple capacitor structure and are therefore easy to
fabricate. However, the market launch of RRAMs is hindered
by several serious obstacles. For example, the underlying
microscopical physical and chemical switching mechanism of
RRAM devices is still under debate although various models
have been proposed to explain the observed phenomena. By
missing a deep understanding of the resistive switching
effect on an atomistic scale, a reliable fabrication of
predictable and well performing Gbit memory seems to be
questionable. This thesis is an attempt to develop and
physically understand the nickel oxide (NiO) based resistive
switching non-volatile memory devices. Although the
underlying microscopical switching mechanism is still under
debate, the macroscopic switching mechanism of this material
system is often described by the creation and rupture of
well-conducting nickel flaments embedded within an
insulating NiO matrix, the so called fuse-antifuse
mechanism. The resistive switching characteristics,
essentials for future non-volatile memories, such as low
voltage and current operation with high resistance ratio
between HRS and LRS, fast switching speed, high retention
and endurance are presented. Additionally, the emphasis is
layed on the understanding of the so called forming process.
It describes the first resistance transition of the
resistive switching device in which the proposed nickel
flament is formed. Therefore, it is the key process for
understanding the resistive switching phenomena. The
statistical distribution of the observed forming process is
studied under accelerated constant voltage stress conditions
and at varying temperatures within the framework of the
Weibull statistics. To understand the physical and chemical
nature of the flamentary structure, the influence of
different ambient atmospheres and temperatures on the
forming process is analyzed electrically as well as
chemically by XPS analysis. Combining these results with the
results of the potentiostatic breakdown studies, a model for
the forming process in Pt/NiO/Pt non-volatile resistive
switching memory devices is proposed.},
cin = {PGI-7},
cid = {I:(DE-Juel1)PGI-7-20110106},
pnm = {521 - Controlling Electron Charge-Based Phenomena
(POF3-521)},
pid = {G:(DE-HGF)POF3-521},
typ = {PUB:(DE-HGF)11 / PUB:(DE-HGF)3},
url = {https://juser.fz-juelich.de/record/202769},
}