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@PHDTHESIS{Kluth:26630,
author = {Kluth, Patrick},
title = {{S}elbstassemblierte {N}anostrukturierung ultradünner
{S}ilizidschichten und {E}ntwicklung von
{N}ano-{MOSFET}-{B}auelementen},
volume = {3994},
issn = {0944-2952},
school = {Techn. Aachen},
type = {Dr. (FH)},
address = {Jülich},
publisher = {Forschungszentrum Jülich GmbH Zentralbibliothek, Verlag},
reportid = {PreJuSER-26630, Juel-3994},
series = {Berichte des Forschungszentrums Jülich},
pages = {182 p.},
year = {2002},
note = {Record converted from VDB: 12.11.2012; Aachen, Techn.,
Hochsch., Diss., 2002},
abstract = {Due to its low resistivity, high scalability and high
thermal stability, CoSi$_{2}$ is widely used as a contact
and interconnect material in silicon microelctronics. In
this thesis a self-assembly process for fabrication of
CoSi$_{2}$-nanostructures is investigated. These structures
can be used as building blocks for advanced microelectronic
devices. The process is based on anisotropic diffusion in a
stress field generated along the edge of a mask consisting
of SiO$_{2}$ and Si$_{3}$N$_{4}$. Using local oxidation
narrow wires and uniform gaps with dimensions down to 20 nm
were produced from 20-30 nm thick single-crystalline,
epitaxial CoSi$_{2}$-layers. Gaps with dimensions of
approximately 100 nm were generated during the silicide
formation in a solid-phase reaction. Using these
nanostructures, we fabricated planar 70 nm gate-length
Schottky barrier MOSFETs on silicon-on-insulator substrates.
These devices can be driven as both p-channel and n-channel
MOSFETs without complementary substrate doping and show good
I-V characteristics and a transconductance of 200 mS
mm$^{-1}$ in the n-channel mode.},
cin = {ISG-1},
cid = {I:(DE-Juel1)VDB41},
pnm = {Materialien, Prozesse und Bauelemente für die Mikro- und
Nanoelektronik},
pid = {G:(DE-Juel1)FUEK252},
typ = {PUB:(DE-HGF)11 / PUB:(DE-HGF)3},
url = {https://juser.fz-juelich.de/record/26630},
}