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000002727 084__ $$2WoS$$aMaterials Science, Ceramics
000002727 1001_ $$0P:(DE-Juel1)VDB15125$$aKügeler, C.$$b0$$uFZJ
000002727 245__ $$aAn Integrated Microelectromechanical Microwave Switch Based on Piezoelectric Actuation
000002727 260__ $$aDordrecht [u.a.]$$bSpringer Science + Business Media B.V$$c2009
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000002727 440_0 $$03263$$aJournal of Electroceramics$$v22$$x1385-3449$$y1
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000002727 520__ $$aIn the field of microwave applications, microelectromechanical systems (MEMS) are attractive devices in order to force miniaturization by on chip integration. Here, we describe the design, fabrication and testing of a silicon based micromachined switch using piezo-electrically actuated elements. The microwave circuit consists of a coplanar waveguide (CPW) design with two piezoelectric activated beams integrated between the middle line and the ground planes. During operation the beams short the CPW by two overhanging bridge contacts and therefore the transmission characteristics of the microwave circuit change. The CPW is realized by 3 A mu m thick electroplated copper to yield good transmission characteristics, whereas the clamped-clamped beams benefit from a 250 nm thin PZT film between 100 nm thin Pt electrodes on top of a SiO2 layer. By the use of double side clamped beams awkward stress compensation of the piezoelectric stack is omitted. Instead the system relies on some initial mechanical stress. Measurements prove deflections of more than 13 A mu m for a 1400 A mu m long beam with operation voltages below 10 V. This is in good agreement with finite element simulations. The novel RF-MEMS is predicted to reach an isolation (in "on" state) of more than 20 dB up to 15 GHz.
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000002727 65320 $$2Author$$aRF-MEMS
000002727 65320 $$2Author$$aPiezoelectric
000002727 65320 $$2Author$$aThin film
000002727 65320 $$2Author$$aPZT
000002727 65320 $$2Author$$aIntegrated microwave switch
000002727 7001_ $$0P:(DE-HGF)0$$aHennings, A.$$b1
000002727 7001_ $$0P:(DE-Juel1)VDB3024$$aBöttger, U.$$b2$$uFZJ
000002727 7001_ $$0P:(DE-Juel1)131022$$aWaser, R.$$b3$$uFZJ
000002727 773__ $$0PERI:(DE-600)1472395-5$$a10.1007/s10832-008-9457-7$$gVol. 22$$q22$$tJournal of electroceramics$$v22$$x1385-3449$$y2009
000002727 8567_ $$uhttp://dx.doi.org/10.1007/s10832-008-9457-7
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000002727 9141_ $$y2009
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000002727 9201_ $$0I:(DE-Juel1)VDB786$$d31.12.2010$$gIFF$$kIFF-6$$lElektronische Materialien$$x0
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