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@ARTICLE{Mai:32208,
      author       = {Mai, T. T. and Schultze, J. W. and Staikov, G.},
      title        = {{M}icrostructured {M}etallization of {I}nsulating
                      {P}olymers},
      journal      = {Electrochimica acta},
      volume       = {48},
      issn         = {0013-4686},
      address      = {New York, NY [u.a.]},
      publisher    = {Elsevier},
      reportid     = {PreJuSER-32208},
      pages        = {3021},
      year         = {2003},
      note         = {Record converted from VDB: 12.11.2012},
      abstract     = {Direct Ni electrodeposition on insulating polymers by the
                      so-called PLATO technique is studied and the application of
                      this technique for microstructured metallization is
                      investigated. Propagation behavior, surface morphology,
                      conductivity and thickness of a deposited metal layer are
                      characterized using microscopy, AFM, four-point conductivity
                      and XPS sputter measurements. Two layers are formed during
                      metal deposition: primary layer and secondary layer. Both
                      layers propagate with constant rates during the first 60 s
                      and the propagation rates are influenced by the
                      metallization potential. The primary layer has hemispherical
                      morphology, low conductivity and an uneven thickness of
                      about 25-100 nm. The secondary layer has the repetition
                      morphology of the primary and higher roughness (R-a(prim) =
                      40 nm, R-a(sec) = 150 nm), higher conductivity
                      (sigma(sec)/sigma(prim) = 10(8)/10(10)) and a thickness of
                      100-200 nm. The high lateral propagation rate of the metal
                      strip during metal deposition offers possibilities for
                      metallization of insulating microstructures. Routines for
                      microstructured metallization using PLATO technique are
                      proposed and examples for the applications are demonstrated.
                      (C) 2003 Elsevier Ltd. All rights reserved.},
      keywords     = {J (WoSType)},
      cin          = {ISG-3},
      ddc          = {540},
      cid          = {I:(DE-Juel1)VDB43},
      pnm          = {Materialien, Prozesse und Bauelemente für die Mikro- und
                      Nanoelektronik},
      pid          = {G:(DE-Juel1)FUEK252},
      shelfmark    = {Electrochemistry},
      typ          = {PUB:(DE-HGF)16},
      UT           = {WOS:000185123400020},
      doi          = {10.1016/S0013-4686(03)00369-4},
      url          = {https://juser.fz-juelich.de/record/32208},
}