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@ARTICLE{Mai:32209,
      author       = {Mai, T. T. and Schultze, J. W. and Staikov, G.},
      title        = {{R}elation between {S}urface {P}reconditioning and {M}etal
                      {D}eposition in {D}irect {G}alvanic {M}etallization of
                      {I}nsulating {S}urfaces},
      journal      = {Journal of solid state electrochemistry},
      volume       = {8},
      issn         = {1432-8488},
      address      = {Berlin},
      publisher    = {Springer},
      reportid     = {PreJuSER-32209},
      pages        = {201},
      year         = {2004},
      note         = {Record converted from VDB: 12.11.2012},
      abstract     = {The relation between surface preconditioning and metal
                      deposition in the direct galvanic metallization of different
                      insulating polymer surfaces by the so-called PLATO technique
                      was studied using electrochemical and surface analytical
                      methods. AFM, XPS and contact angle measurements show that
                      the chromic acid etching of original polymer surfaces leads
                      to an increase of the surface energy and hydrophilicity of
                      polymer substrates due to both surface roughening and the
                      formation of -COOH and/or -COH surface groups. However,
                      decisive for the subsequent surface activation with cobalt
                      sulfide is the increase in surface roughness. The influence
                      of the degree of activation and the electrode potential on
                      the kinetics of Ni metallization was studied by current
                      transient measurements on activated line-shaped structures.
                      The results suggest that the electrochemical reduction of
                      cobalt sulfide to cobalt is a necessary step to induce the
                      process of Ni electrodeposition. Successful Ni metallization
                      could be obtained on ABS (acrylonitrile-butadiene-styrene)
                      and PEEK (poly-ether-ether-ketone) surfaces. The lateral
                      propagation rate, V-x, of the depositing Ni layer depends
                      exponentially on the applied potential and was found to be
                      several orders of magnitude higher than the Ni deposition
                      rate, V-z, in the normal z-direction (V-x/V-z=10(2)-10(4)).
                      It was demonstrated that the approach involving cobalt
                      sulfide pre-activation can also be applied successfully for
                      metallization of oxidized porous silicon surfaces.},
      keywords     = {J (WoSType)},
      cin          = {ISG-3},
      ddc          = {540},
      cid          = {I:(DE-Juel1)VDB43},
      pnm          = {Kondensierte Materie},
      pid          = {G:(DE-Juel1)FUEK242},
      shelfmark    = {Electrochemistry},
      typ          = {PUB:(DE-HGF)16},
      UT           = {WOS:000188495500011},
      doi          = {10.1007/s10008-003-0426-4},
      url          = {https://juser.fz-juelich.de/record/32209},
}