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000037407 0881_ $$aJuel-4069
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000037407 1001_ $$0P:(DE-Juel1)VDB5812$$aStock, Jürgen$$b0$$eCorresponding author$$uFZJ
000037407 245__ $$aHerstellung und Charakterisierung von GaAs Gunn-Dioden für Anwendungen bei 77 GHz
000037407 260__ $$aJülich$$bForschungszentrum Jülich GmbH Zentralbibliothek, Verlag$$c2003
000037407 300__ $$aIII, 137 p.
000037407 3367_ $$0PUB:(DE-HGF)11$$2PUB:(DE-HGF)$$aDissertation / PhD Thesis
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000037407 4900_ $$0PERI:(DE-600)2414853-2$$813585$$aBerichte des Forschungszentrums Jülich$$v4069$$x0944-2952
000037407 502__ $$aAachen, Techn. Hochsch., Diss., 2003$$bDr. (FH)$$cTechn. Hochsch. Aachen$$d2003
000037407 500__ $$aRecord converted from VDB: 12.11.2012
000037407 520__ $$aIn the present thesis the properties of GaAs Gunn diodes with a hot electron injector have been investigated which are used to generate microwave power e.g. in radar and satellite technology or in intelligent control systems in the field of automotive electronics. The diodes have been characterized using different measurement methods which allow the analysis of the DC curves, the small signal behavior and the second harmonie mode operation in an oscillator. Furthermore the process technology has been developed to fabricate Gunn diode chips with integrated heat sink used in oscillators and coplanar Gunn diodes for small signal measurements. The operation principle of a Gunn diode is based on the so-called Gunn effect which originates from a particular electron scattering process in the conduction band of GaAs. Using a hot electron injector consisting of a linearly graded AlGaAs barrier and an adjacent delta doped layer the scattering process is reinforced and the efficiency of the device is improved. It has been shown that an undoped GaAs spacer layer between the AlGaAs barrier and the delta doped layer can prevent the unintentional diffusion of doping atoms towards the AlGaAs barrier and therefore enhances the effect of the injector. The homogeneity and reproducibility of the fabrication process has been increased compared to existing methods by introducing an etch stop layer for the substrate removal and by using a plasma etching process for the definition of the Gunn diode mesa.
000037407 536__ $$0G:(DE-Juel1)FUEK252$$2G:(DE-HGF)$$aMaterialien, Prozesse und Bauelemente für die  Mikro- und Nanoelektronik$$cI01$$x0
000037407 655_7 $$aHochschulschrift$$xDissertation (FH)
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000037407 9201_ $$0I:(DE-Juel1)VDB41$$d31.12.2006$$gISG$$kISG-1$$lInstitut für Halbleiterschichten und Bauelemente$$x0
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