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@ARTICLE{Mai:46697,
      author       = {Mai, T. T. and Schultze, J. W. and Staikov, G. and Munoz,
                      A. G.},
      title        = {{M}echanism of {G}alvanic {M}etallization of
                      {C}o{S}-{A}ctivated {I}nsulating {P}olymer {S}urfaces},
      journal      = {Thin solid films},
      volume       = {488},
      issn         = {0040-6090},
      address      = {Amsterdam [u.a.]},
      publisher    = {Elsevier},
      reportid     = {PreJuSER-46697},
      pages        = {321 - 328},
      year         = {2005},
      note         = {Record converted from VDB: 12.11.2012},
      abstract     = {The mechanism of direct galvanic metallization of
                      insulating polymer surfaces activated by CoS(beta) particles
                      is investigated by means of conventional electrochemical
                      techniques-and surface analysis. The results show that a
                      necessary step to induce metal electrodeposition is the
                      electrochemical reduction of CoS(beta) occurring at
                      potentials E < - 0.25 V It is demonstrated that a direct
                      galvanic metallization can be carried out only by
                      electrodeposition of metals and alloys with a plating zone
                      overlapping the reduction zone of CoS. The electrochemical
                      reduction of CoS is limited by the solid state transport of
                      sulphide ions from the bulk to the surface of CoS(beta)
                      particles. The resulting thin Co film on the particle
                      surface catalyzes the reduction of the depositing metal
                      leading to the formation of a primary metal film of 10-40 nm
                      thickness. This primary film, in turn, acts as a seed layer,
                      onto which further deposition of a secondary metal layer of
                      higher conductivity takes place. The formation of the
                      primary metal film makes it possible to contact neighbouring
                      CoS particles and hence, further lateral propagation of the
                      metal layer. Experimental results suggest that the
                      propagation rate of the metal layer is controlled by the
                      kinetics of sulphide reduction. (c) 2005 Elsevier B.V. All
                      rights reserved.},
      keywords     = {J (WoSType)},
      cin          = {ISG-3 / CNI},
      ddc          = {070},
      cid          = {I:(DE-Juel1)VDB43 / I:(DE-Juel1)VDB381},
      pnm          = {Materialien, Prozesse und Bauelemente für die Mikro- und
                      Nanoelektronik},
      pid          = {G:(DE-Juel1)FUEK252},
      shelfmark    = {Materials Science, Multidisciplinary / Materials Science,
                      Coatings $\&$ Films / Physics, Applied / Physics, Condensed
                      Matter},
      typ          = {PUB:(DE-HGF)16},
      UT           = {WOS:000231435300050},
      doi          = {10.1016/j.tsf.2005.04.069},
      url          = {https://juser.fz-juelich.de/record/46697},
}