001     46697
005     20180209101707.0
024 7 _ |2 DOI
|a 10.1016/j.tsf.2005.04.069
024 7 _ |2 WOS
|a WOS:000231435300050
037 _ _ |a PreJuSER-46697
041 _ _ |a eng
082 _ _ |a 070
084 _ _ |2 WoS
|a Materials Science, Multidisciplinary
084 _ _ |2 WoS
|a Materials Science, Coatings & Films
084 _ _ |2 WoS
|a Physics, Applied
084 _ _ |2 WoS
|a Physics, Condensed Matter
100 1 _ |a Mai, T. T.
|b 0
|0 P:(DE-HGF)0
245 _ _ |a Mechanism of Galvanic Metallization of CoS-Activated Insulating Polymer Surfaces
260 _ _ |a Amsterdam [u.a.]
|b Elsevier
|c 2005
300 _ _ |a 321 - 328
336 7 _ |a Journal Article
|0 PUB:(DE-HGF)16
|2 PUB:(DE-HGF)
336 7 _ |a Output Types/Journal article
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336 7 _ |a Journal Article
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336 7 _ |a ARTICLE
|2 BibTeX
336 7 _ |a JOURNAL_ARTICLE
|2 ORCID
336 7 _ |a article
|2 DRIVER
440 _ 0 |a Thin Solid Films
|x 0040-6090
|0 5762
|v 488
500 _ _ |a Record converted from VDB: 12.11.2012
520 _ _ |a The mechanism of direct galvanic metallization of insulating polymer surfaces activated by CoS(beta) particles is investigated by means of conventional electrochemical techniques-and surface analysis. The results show that a necessary step to induce metal electrodeposition is the electrochemical reduction of CoS(beta) occurring at potentials E < - 0.25 V It is demonstrated that a direct galvanic metallization can be carried out only by electrodeposition of metals and alloys with a plating zone overlapping the reduction zone of CoS. The electrochemical reduction of CoS is limited by the solid state transport of sulphide ions from the bulk to the surface of CoS(beta) particles. The resulting thin Co film on the particle surface catalyzes the reduction of the depositing metal leading to the formation of a primary metal film of 10-40 nm thickness. This primary film, in turn, acts as a seed layer, onto which further deposition of a secondary metal layer of higher conductivity takes place. The formation of the primary metal film makes it possible to contact neighbouring CoS particles and hence, further lateral propagation of the metal layer. Experimental results suggest that the propagation rate of the metal layer is controlled by the kinetics of sulphide reduction. (c) 2005 Elsevier B.V. All rights reserved.
536 _ _ |a Materialien, Prozesse und Bauelemente für die Mikro- und Nanoelektronik
|c I01
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588 _ _ |a Dataset connected to Web of Science
650 _ 7 |a J
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653 2 0 |2 Author
|a nickel
653 2 0 |2 Author
|a metallization
653 2 0 |2 Author
|a cobalt
653 2 0 |2 Author
|a sulphides
653 2 0 |2 Author
|a polymers
700 1 _ |a Schultze, J. W.
|b 1
|0 P:(DE-HGF)0
700 1 _ |a Staikov, G.
|b 2
|u FZJ
|0 P:(DE-Juel1)VDB13645
700 1 _ |a Munoz, A. G.
|b 3
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|0 P:(DE-Juel1)VDB60931
773 _ _ |a 10.1016/j.tsf.2005.04.069
|g Vol. 488, p. 321 - 328
|p 321 - 328
|q 488<321 - 328
|0 PERI:(DE-600)1482896-0
|t Thin solid films
|v 488
|y 2005
|x 0040-6090
856 7 _ |u http://dx.doi.org/10.1016/j.tsf.2005.04.069
909 C O |o oai:juser.fz-juelich.de:46697
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913 1 _ |k I01
|v Materialien, Prozesse und Bauelemente für die Mikro- und Nanoelektronik
|l Informationstechnologie mit nanoelektronischen Systemen
|b Information
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914 1 _ |y 2005
915 _ _ |0 StatID:(DE-HGF)0010
|a JCR/ISI refereed
920 1 _ |k ISG-3
|l Institut für Grenzflächen und Vakuumtechnologien
|d 31.12.2006
|g ISG
|0 I:(DE-Juel1)VDB43
|x 0
920 1 _ |k CNI
|l Center of Nanoelectronic Systems for Information Technology
|d 14.09.2008
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980 _ _ |a UNRESTRICTED
981 _ _ |a I:(DE-Juel1)PGI-3-20110106
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