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000051341 084__ $$2WoS$$aEngineering, Electrical & Electronic
000051341 084__ $$2WoS$$aNanoscience & Nanotechnology
000051341 084__ $$2WoS$$aOptics
000051341 084__ $$2WoS$$aPhysics, Applied
000051341 1001_ $$0P:(DE-Juel1)VDB34541$$aKronholz, S.$$b0$$uFZJ
000051341 245__ $$aProtected Nanoelectrodes of two different Metals with 30 nm Gap-width and Access-window
000051341 260__ $$a[S.l.] @$$bElsevier$$c2006
000051341 300__ $$a1702 - 1705
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000051341 440_0 $$04347$$aMicroelectronic Engineering$$v83$$x0167-9317
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000051341 520__ $$aReproducible fabrication of 30 nm metallic nanogaps on silicon chips and their electrochemical characterization are presented. The fabrication of the chip is a combination of an optical lithography step and two electron-beam (e-beam) steps. An optimized adhesion layer/metal layer combination (Ti/Pt/Au) and an adopted two layer e-beam resist are used. Specifically the chip has been covered with different protection layers, access windows located on top of the nanogaps, calibration electrodes and contact pads, respectively. After characterization of the gaps and of the protection layer in 0.1 M H2SO4 aqueous electrolyte, the deposition of Cu onto the nanogaps was demonstrated successfully. (c) 2006 Elsevier B.V. All rights reserved.
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000051341 65320 $$2Author$$ananogaps
000051341 65320 $$2Author$$acyclic voltammetry
000051341 65320 $$2Author$$aprotection layer
000051341 65320 $$2Author$$aelectrochemistry
000051341 7001_ $$0P:(DE-Juel1)130751$$aKarthäuser, S.$$b1$$uFZJ
000051341 7001_ $$0P:(DE-Juel1)VDB45470$$aMeszaros, G.$$b2$$uFZJ
000051341 7001_ $$0P:(DE-Juel1)VDB9859$$aWandlowski, Th.$$b3$$uFZJ
000051341 7001_ $$0P:(DE-HGF)0$$aVan Der Hart, A.$$b4
000051341 7001_ $$0P:(DE-Juel1)131022$$aWaser, R.$$b5$$uFZJ
000051341 773__ $$0PERI:(DE-600)1497065-x$$a10.1016/j.mee.2005.12.023$$gVol. 83, p. 1702 - 1705$$p1702 - 1705$$q83<1702 - 1705$$tMicroelectronic engineering$$v83$$x0167-9317$$y2006
000051341 8567_ $$uhttp://dx.doi.org/10.1016/j.mee.2005.12.023
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000051341 9201_ $$0I:(DE-Juel1)VDB321$$d31.12.2006$$gIFF$$kIFF-IEM$$lElektronische Materialien$$x0
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000051341 9201_ $$0I:(DE-Juel1)VDB42$$d31.12.2006$$gISG$$kISG-2$$lInstitut für Bio- und Chemosensoren$$x2
000051341 9201_ $$0I:(DE-Juel1)VDB43$$d31.12.2006$$gISG$$kISG-3$$lInstitut für Grenzflächen und Vakuumtechnologien$$x3
000051341 9201_ $$0I:(DE-82)080009_20140620$$gJARA$$kJARA-FIT$$lJülich-Aachen Research Alliance - Fundamentals of Future Information Technology$$x4
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