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000057272 084__ $$2WoS$$aNanoscience & Nanotechnology
000057272 1001_ $$0P:(DE-Juel1)VDB65132$$aChan, K. Y.$$b0$$uFZJ
000057272 245__ $$aAtomic force microscopy (AFM) and X-ray diffraction (XRD) investigations of copper thin films prepared by dc magnetron sputtering technique
000057272 260__ $$aAmsterdam [u.a.]$$bElsevier Science$$c2006
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000057272 520__ $$aThis paper addresses the influences of sputtering power and deposition pressure on the surface morphology and structural behavior of dc magnetron sputter-deposited copper (Cu) thin films on p-type silicon grown at room temperature. Results from our experiments show that the deposition rate of the Cu film increases proportionally with the sputtering power and decreases with deposition pressure. From the atomic force microscopy (AFM) and X-ray diffraction (XRD) analysis, high sputtering power enhances the microstructure of the Cu film through the surface diffusion mechanism of the adatom. The poor microstructure as a result of low sputtering power deposition was manifested with the smaller value of Cu film root mean square (RMS) roughness obtained. The deposition pressure has the contrary influence on structural properties of Cu film in which high deposition pressure favors the formation of voided boundaries film structure with degraded film crystallinity due to the shadowing effect, which varies with different deposition pressures. (c) 2006 Elsevier Ltd. All rights reserved.
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000057272 65320 $$2Author$$acopper
000057272 65320 $$2Author$$asputtering power
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000057272 65320 $$2Author$$amorphology
000057272 65320 $$2Author$$amicrostructure
000057272 7001_ $$0P:(DE-HGF)0$$aTeo, B.-S.$$b1
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