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@ARTICLE{Yuan:808667,
      author       = {Yuan, Y. and Du, Juan and Wirtz, Marius and Luo, G. and Lu,
                      G.-H. and Liu, W.},
      title        = {{S}urface damage and {S}tructure {E}volution of
                      {R}ecrystallized {T}ungsten {E}xposed to {ELM} {L}ike
                      {T}ransient {L}oads},
      journal      = {Nuclear fusion},
      volume       = {56},
      issn         = {0029-5515},
      address      = {Vienna},
      publisher    = {IAEA},
      reportid     = {FZJ-2016-02300},
      pages        = {036021},
      year         = {2016},
      abstract     = {Surface damage and structure evolution of the full tungsten
                      ITER divertor under transient heat loads is a key concern
                      for component lifetime and plasma operations.
                      Recrystallization caused by transients and steady-state heat
                      loads can lead to degradation of the material properties and
                      is therefore one of the most serious issues for tungsten
                      armor. In order to investigate the thermal response of the
                      recrystallized tungsten under edge localized mode-like
                      transient thermal loads, fully recrystallized tungsten
                      samples with different average grain sizes are exposed to
                      cyclic thermal shocks in the electron beam facility JUDITH
                      1. The results indicate that not only does the
                      microstructure change due to recrystallization, but that the
                      surface residual stress induced by mechanical polishing
                      strongly influences the surface cracking behavior. The
                      stress-free surface prepared by electro-polishing is shown
                      to be more resistant to cracking than the mechanically
                      polished one. The resulting surface roughness depends
                      largely on the loading conditions instead of the
                      recrystallized-grain size. As the base temperature increases
                      from room temperature to 400 °C, surface roughening mainly
                      due to the shear bands in each grain becomes more
                      pronounced, and sub-grains (up to 3 μm) are simultaneously
                      formed in the sub-surface. The directions of the shear bands
                      exhibit strong grain-orientation dependence, and they are
                      generally aligned with the traces of {1 1 2} twin habit
                      planes. The results suggest that twinning deformation and
                      dynamic recrystallization represent the predominant
                      mechanism for surface roughening and related microstructure
                      evolution.},
      cin          = {IEK-2},
      ddc          = {530},
      cid          = {I:(DE-Juel1)IEK-2-20101013},
      pnm          = {174 - Plasma-Wall-Interaction (POF3-174)},
      pid          = {G:(DE-HGF)POF3-174},
      typ          = {PUB:(DE-HGF)16},
      UT           = {WOS:000373378200022},
      doi          = {10.1088/0029-5515/56/3/036021},
      url          = {https://juser.fz-juelich.de/record/808667},
}