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@INPROCEEDINGS{Durini:810323,
author = {Durini, Daniel},
title = {{S}ilicon based photodetection in science: challenges and
perspectives},
reportid = {FZJ-2016-03174},
year = {2016},
abstract = {The entire silicon based imaging industry evolved around
the concept of charge-coupled devices (CCD) [1] introduced
in 1969. In parallel to the development of the CCD
technology, in the 1990’s and 2000’s the entire CMOS
based microelectronic industry was making huge advances in
what the processing technology is concerned. In the early
1990s, huge efforts were first started to take advantage of
this highly developed process technology to try to create
highly functional single-chip image sensors where low cost,
high yield, and the possibility of inclusion of in-pixel
intelligence and on-chip signal processing – an electronic
camera-on-a-chip [2] – was the driving factor. Reaching
the 2010’s, instead of having CMOS processes that deliver
highly functional logic circuitry with quite bad front-end
photosensing performance, most foundries started investing
in the development of photosensitivity enhanced processes
still capable of delivering a quite acceptable CMOS
functionality. Near single photon counting with picosecond
time resolution has been one of the main breakthroughs of
the last couple of years. This was achieved in the form of
single-photon counting avalanche diodes (SPADs) [3] and
Silicon Photomultipliers (SiPMs) [4]. They are realized
nowadays in advanced CMOS technologies. Nevertheless, higher
readout speeds, single-photon counting capabilities, higher
fill-factors, and higher sensitivities are all issues not
easy to be solved using standard planar technologies.
Moreover, extending the spectra of the radiation to be
detected beyond the visible spectra becomes only possible if
different materials are used that are not necessarily
compatible with the CMOS technology. Currently, hybrid and
3D photodetector technologies are being developed to address
these challenges “using the best from several worlds”.
But many technical hurdles still need to be addressed. All
these developments opened the possibility of using silicon
based photodetectors in different scientific applications
ranging from spectroscopy, positron emission tomography,
neutron detection, or photon science to particle physics.
The technological challenges and future perspectives of
different silicon based photodetection technologies will be
introduced based on several examples.References:1. Amelio G.
F. et al. “Experimental verification of the charge coupled
device concept”, Bell Syst. Tech. Journal, 49 (4), 593 –
600 (1970)2. Fossum E. R. “CMOS image sensors: electronic
camera-on-a-chip”, IEEE IEDM Tech. Digest, 17 – 25
(1995)3. Cova S. et al. “Towards picosecond resolution
with single-photon avalanche diodes”, Rev. Sci. Instr.,
52, 408 (1981)4. Gasanov A. et al. “Avalanche Detector”,
Russian patent No. 1702831 (1989)5. Durini D. and Arutinov
D., „Chapter 2: Operational principles of silicon image
sensors” in High Performance Silicon Imaging, Ed. Durini
D., Woodhead Publishing Ltd. an imprint of Elsevier, UK, p.
25 - 77 (2014)},
month = {Jun},
date = {2016-06-06},
organization = {2016 EMN Photodetectors Meeting,
Cancún (Mexiko), 6 Jun 2016 - 9 Jun
2016},
subtyp = {Invited},
cin = {ZEA-2},
cid = {I:(DE-Juel1)ZEA-2-20090406},
pnm = {632 - Detector technology and systems (POF3-632)},
pid = {G:(DE-HGF)POF3-632},
typ = {PUB:(DE-HGF)6},
url = {https://juser.fz-juelich.de/record/810323},
}