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@INPROCEEDINGS{Durini:824879,
author = {Durini, Daniel},
title = {{S}ilicon {B}ased {P}hotodetection in {S}cience},
reportid = {FZJ-2016-07381},
year = {2016},
abstract = {The entire silicon based imaging industry evolved around
the concept of charge-coupled devices (CCD) [1] introduced
in 1969. In parallel to the development of the CCD
technology, in the 1990’s and 2000’s the entire CMOS
based microelectronic industry was making huge advances in
what the processing technology is concerned. In the early
1990s, huge efforts were first started to take advantage of
this highly developed process technology to try to create
highly functional single-chip image sensors where low cost,
high yield, and the possibility of inclusion of in-pixel
intelligence and on-chip signal processing – an electronic
camera-on-a-chip [2] – was the driving factor. Reaching
the 2010’s, instead of having CMOS processes that deliver
highly functional logic circuitry with quite bad front-end
photosensing performance, some specialized foundries started
investing in the development of photosensitivity enhanced
processes still capable of delivering a quite acceptable
CMOS functionality. Near single photon counting with
nanosecond and sub-nanosecond time resolution has been one
of the main breakthroughs of the last couple of years. This
was achieved in the form of single-photon counting avalanche
diode (SPAD) arrays [3] and Silicon Photomultipliers (SiPMs)
[4]. They are realized nowadays in advanced CMOS
technologies or dedicated processes. Nevertheless, higher
readout speeds, single-photon counting capabilities, higher
fill-factors, and higher sensitivities are all issues not
easy to be solved using standard planar technologies.
Moreover, extending the spectra of the radiation to be
detected beyond the visible spectra becomes only possible if
different materials are used that are not necessarily
compatible with the CMOS technology. Currently, hybrid and
3D photodetector technologies are being developed to address
these challenges “using the best from several worlds”.
But many technical hurdles still need to be addressed. All
these developments opened the possibility of using silicon
based photodetectors in different scientific applications
ranging from spectroscopy, positron emission tomography
(PET), neutron detection, space applications to particle
physics. The technological challenges and future
perspectives of different silicon based photodetection
technologies will be introduced based on several
examples.References:[1] Amelio G. F. et al. “Experimental
verification of the charge coupled device concept”, Bell
Syst. Tech. Journal, 49 (4), 593 – 600 (1970)[2] Fossum E.
R. “CMOS image sensors: electronic camera-on-a-chip”,
IEEE IEDM Tech. Digest, 17 – 25 (1995)[3] Cova S. et al.
“Towards picosecond resolution with single-photon
avalanche diodes”, Rev. Sci. Instr., 52, 408 (1981)[4]
Gasanov A. et al. “Avalanche Detector”, Russian patent
No. 1702831 (1989)[5] Durini D. and Arutinov D., „Chapter
2: Operational principles of silicon image sensors” in
High Performance Silicon Imaging, Ed. Durini D., Woodhead
Publishing Ltd. an imprint of Elsevier, UK, p. 25 - 77
(2014)},
month = {Sep},
date = {2016-09-21},
organization = {8th Seminar on Electronics and
Advanced Design, Puebla (Mexico), 21
Sep 2016 - 23 Sep 2016},
subtyp = {Invited},
cin = {ZEA-2},
cid = {I:(DE-Juel1)ZEA-2-20090406},
pnm = {632 - Detector technology and systems (POF3-632) / 573 -
Neuroimaging (POF3-573) / 6G4 - Jülich Centre for Neutron
Research (JCNS) (POF3-623)},
pid = {G:(DE-HGF)POF3-632 / G:(DE-HGF)POF3-573 /
G:(DE-HGF)POF3-6G4},
experiment = {EXP:(DE-MLZ)KWS1-20140101},
typ = {PUB:(DE-HGF)6},
url = {https://juser.fz-juelich.de/record/824879},
}