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@ARTICLE{Kim:836904,
author = {Kim, Do Yun and Lentz, Florian and Liu, Yong and Singh,
Aryak and Richter, Alexei and Pomaska, Manuel and Lambertz,
Andreas and Ding, Kaining},
title = {{S}elective {D}ry {E}tching of p-{T}ype {S}i {F}ilms for
{P}hotolithography {P}rocessing of {I}nterdigitated {B}ack
{C}ontact {S}ilicon {H}eterojunction {S}olar {C}ells},
journal = {IEEE journal of photovoltaics},
volume = {7},
number = {5},
issn = {2156-3381},
address = {New York, NY},
publisher = {IEEE},
reportid = {FZJ-2017-05936},
pages = {1292 - 1297},
year = {2017},
abstract = {Highly doped p-type Si thin films are hardly etched by
alkaline etchants unlike i- and n-type Si films. In
addition, the use of a HNO3/HF/H2O mixture to etch p-type Si
films can lead to inhomogeneous etching of p-type Si films
and consequently result in excessive surface roughness and
inferior surface passivation. For these reasons, we have
implemented a dry etching method to selectively pattern
p-type Si films for interdigitated back contact (IBC)
silicon heterojunction (SHJ) solar cells using a SiOx
masking layer. In this way, the underlying passivation layer
and the Si surfaces can be undamaged. In this study, the
etch rates of all Si films that make up IBC-SHJ solar cells
have been investigated in order to obtain high etch
selectivity and establish proper patterning steps.
Furthermore, we have fabricated IBC-SHJ solar cells on
planar wafers by using dry and wet patterning methods
developed in this study. As a result, a conversion
efficiency of $15.7\%$ is obtained with Voc of 682 mV, Jsc
of 33.8 mA/cm2, and FF of 0.68.},
cin = {IEK-5},
ddc = {530},
cid = {I:(DE-Juel1)IEK-5-20101013},
pnm = {121 - Solar cells of the next generation (POF3-121) / HITEC
- Helmholtz Interdisciplinary Doctoral Training in Energy
and Climate Research (HITEC) (HITEC-20170406)},
pid = {G:(DE-HGF)POF3-121 / G:(DE-Juel1)HITEC-20170406},
typ = {PUB:(DE-HGF)16},
UT = {WOS:000408160700017},
doi = {10.1109/JPHOTOV.2017.2719866},
url = {https://juser.fz-juelich.de/record/836904},
}