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@ARTICLE{Back:838249,
      author       = {Back, Hyoung C. and Mutter, Markus and Gibmeier, Jens and
                      Mücke, Robert and Vaßen, Robert},
      title        = {{R}esidual {S}tress {D}epth {D}istributions for
                      {A}tmospheric {P}lasma {S}prayed {M}n{C}o1.9{F}e0.1{O}4
                      {S}pinel {L}ayers on {C}rofer {S}teel {S}ubstrate},
      journal      = {Materials science forum},
      volume       = {905},
      issn         = {1662-9752},
      address      = {Uetikon},
      publisher    = {Trans Tech Publ.},
      reportid     = {FZJ-2017-06904},
      pages        = {174 - 181},
      year         = {2017},
      abstract     = {In solid oxide fuel cells (SOFC) for operating temperatures
                      of 800 °C or below, the use of ferritic stainless steel can
                      lead to degradation in cell performance due to chromium
                      migration into the cells at the cathode side [1].
                      Application of a coating on the ferritic stainless steel
                      interconnect is one option to prevent Cr outward migration
                      through the coating. MnCo1.9Fe0.1O4 (in the following
                      designated as MCF) spinels act as a diffusion barrier and
                      retain high conductivity during operation [2]. Knowledge
                      about the residual stress depth distribution throughout the
                      complete APS coating system is important and can help to
                      optimize the coating process. This implicitly requires
                      reliable residual stress analysis in the coating, the
                      interface region and in the substrate.For residual stress
                      analysis on these specific layered systems diffraction based
                      analysis methods (XRD) using laboratory X-ray sources can
                      only by applied at the very surface. For larger depths
                      sublayer removal is necessary to gain reliable residual
                      stress data. The established method for sublayer removal is
                      electrochemical etching, which fails, since the spinel layer
                      is inert. However, a mechanical layer removal will affect
                      the local residual stress distribution.As an alternative,
                      mechanical residual stress analyses techniques can be
                      applied. Recently, we established an approach to analyse
                      residual stress depth distributions in thick film systems by
                      means of the incremental hole drilling method [5, 6]. In
                      this project, we refined our approach for the application on
                      MCF coatings with a layer thickness between 60 – 125 μm.},
      cin          = {IEK-1},
      ddc          = {670},
      cid          = {I:(DE-Juel1)IEK-1-20101013},
      pnm          = {113 - Methods and Concepts for Material Development
                      (POF3-113)},
      pid          = {G:(DE-HGF)POF3-113},
      typ          = {PUB:(DE-HGF)16},
      doi          = {10.4028/www.scientific.net/MSF.905.174},
      url          = {https://juser.fz-juelich.de/record/838249},
}