% IMPORTANT: The following is UTF-8 encoded. This means that in the presence
% of non-ASCII characters, it will not work with BibTeX 0.99 or older.
% Instead, you should use an up-to-date BibTeX implementation like “bibtex8” or
% “biber”.
@PHDTHESIS{Aslam:841226,
author = {Aslam, Nabeel},
title = {{R}esistive switching memory devices fromatomic layer
deposited binary and ternaryoxide thin films},
volume = {52},
school = {RWTH Aachen},
type = {Dissertation},
address = {Jülich},
publisher = {Forschungszentrum Jülich GmbH Zentralbibliothek, Verlag},
reportid = {FZJ-2017-08318},
isbn = {978-3-95806-274-0},
series = {Schriften des Forschungszentrums Jülich. Reihe Information
/ Information},
pages = {X, 172 S.},
year = {2017},
note = {RWTH Aachen, Diss., 2017},
abstract = {Redox-based resistive switching memory (ReRAM) is
rigorously investigated for next generation non-volatile
storage devices, which comprise the new storage class
memory(SCM) and realizations of logic in memory functions
that aim towards the internet of things (IoT) and to
neuromorphic computing. These applications require an
aggressive downscaling of the energy consumption of the new
memory devices as compared to actually used volatile dynamic
random access memory (DRAM) or non-volatile Flash memory.
ReRAM perfectly fits here due to its high energy efficiency,
that means, low voltage operation, good endurance and stable
retention at high integration density. The ReRAM function is
based on the capability of certain metal/metal oxide/metal
cells to change the resistance when electric stimuli are
applied. For cell dimensions of a few 10 nm in each
direction, the local uniformity of the resistive switching
(RS) layer and its compositional homogeneity become an
issue. So far, a lot of ReRAM research has been performed on
rather thick (>25 nm) oxides grown by physical vapor
deposition. For industrial application, atomic layer
deposition (ALD) will be given priority because of its
potential to grow ultrathin metal oxide films of high
density and homogeneity with a conformal coverage. Most ALD
oxide films are as grown in the amorphous state and
crystallization heat treatment is performed prior to
integration. However, for ultrathin (~10 nm) films there is
rather limited information on compositional homogeneity
after annealing. This effect is of particular importance for
ternary thin films where the local cation (off-)
stoichiometry might affect the microstructure and also the
switching performance of the entire device. Highest
integration density of ReRAM is achieved if the individual
memristors are integrated into a passive crossbar array.
However, sneak path currents through unselected cells
neighbouring the switching cell put a severe restriction on
the maximal achievable amount of cells in this array.
Therefore, biploar-type selectors have to be added to each
memristor. Selectors can be obtained from volatile threshold
switches, like, for example, NbO$_{2}$, while the adjustment
of the required phase is an issue. Inspired by the dynamics
of the constantly growing ReRAM research this work deals
with two oxidic materials where stoichiometries and phase
formations play a crucial role. Both systems, namely
strontium titanate (Sr$_{x}$Ti$_{y}$O$_{z}$ (short: STO))
and niobium oxide (Nb$_{2}$O$_{5}$/NbO$_{2}$), have been so
far seldomly utilized in ReRAM devices when grown by [...]},
cin = {PGI-7 / JARA-FIT},
cid = {I:(DE-Juel1)PGI-7-20110106 / $I:(DE-82)080009_20140620$},
pnm = {899 - ohne Topic (POF3-899)},
pid = {G:(DE-HGF)POF3-899},
typ = {PUB:(DE-HGF)3 / PUB:(DE-HGF)11},
url = {https://juser.fz-juelich.de/record/841226},
}