% IMPORTANT: The following is UTF-8 encoded. This means that in the presence
% of non-ASCII characters, it will not work with BibTeX 0.99 or older.
% Instead, you should use an up-to-date BibTeX implementation like “bibtex8” or
% “biber”.
@PHDTHESIS{Zhang:862756,
author = {Zhang, Hehe},
title = {{R}esistive switching phenomena in stacks of binary
transition metal oxides grown by atomic layer deposition},
volume = {57},
school = {RWTH Aachen},
type = {Dissertation},
address = {Jülich},
publisher = {Forschungszentrum Jülich GmbH Zentralbibliothek, Verlag},
reportid = {FZJ-2019-02998},
isbn = {978-3-95806-399-0},
series = {Schriften des Forschungszentrums Jülich. Reihe Information
/ Information},
pages = {IX, 196 S.},
year = {2019},
note = {RWTH Aachen, Diss., 2019},
abstract = {Information technology is approaching the era of artificial
intelligence. New computing architectures are required to
cope with the huge amount of data that has to be processed
in all types of cognitive applications. This requires
dedicated energy efficient solutions on the level of the
computing hardware. The new concepts of neuromorphic
computing(NC), like artificial neural networks (ANNs) and
computation in memory (CIM), aim to overcome the limitations
of classical computers based on von Neumann architecture.
Redox-type resistive random access memory (ReRAM) devices
are intensively investigated for NC applications due to
their non-volatility and energy efficiency, process
compatibility with standard complementary metal oxide
semiconductor (CMOS) technology, and the ability for device
scaling and three-dimensional (3D) integration. The variety
of applications requests for different desired properties of
the ReRAM devices ranging from an analog-type programmable
multilevel behavior to a binary-type switching at high
resistance ratio and with linear resistance states. ReRAM
research today focuses on devices built of metal oxide
layers with nanometer thickness sandwiched between a
chemically inert electrode like Pt or TiN and a chemically
reactive electrode. The precise thickness control is
achieved by vapor phase deposition techniques, in
particular, atomic layer deposition (ALD). However, some
basic issues like switching stability and resistance
variability are still obstacles on the way towards massive
integration. One of the efforts to improve the device
performance is the use of combinations of two metal oxides
layers, so called bilayer oxide stacks. The two different
metal oxide layers are selected regarding their insulation
resistance and oxidation enthalpy. Here, especially the
bilayer ReRAM stack of TiO$_{2}$ and Al$_{2}$O$_{3}$ has
drawn attention of researches worldwide. TiO$_{2}$ belongs
to the materials integrated into ReRAM devices since the
early start in the beginning of this millennium. However,
most of the single-layer TiO$_{2}$ devices lack stability in
the standard valence change mechanism (VCM)-type filamentary
switching behavior and suffer from a too high residual
leakage current. One approach for improvement is the
addition of an Al$_{2}$O$_{3}$ barrier layer into the
TiO$_{2}$ ReRAM device. So far, in the scientific
literature, there is no clear consensus if this type of
Al$_{2}$O$_{3}$/TiO$_{2}$ bilayer cells reveal a standard
VCM-type filamentary switching or an area-dependent
switching behavior. [...]},
cin = {PGI-10 / PGI-7 / JARA-FIT},
cid = {I:(DE-Juel1)PGI-10-20170113 / I:(DE-Juel1)PGI-7-20110106 /
$I:(DE-82)080009_20140620$},
pnm = {524 - Controlling Collective States (POF3-524)},
pid = {G:(DE-HGF)POF3-524},
typ = {PUB:(DE-HGF)3 / PUB:(DE-HGF)11},
url = {https://juser.fz-juelich.de/record/862756},
}