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001     870376
005     20230207130542.0
024 7 _ |a G:(EU-Grant)826647
|d 826647
|2 CORDIS
024 7 _ |a G:(EU-Call)H2020-SGA-LPMT-2018
|d H2020-SGA-LPMT-2018
|2 CORDIS
024 7 _ |a corda__h2020::826647
|2 originalID
035 _ _ |a G:(EU-Grant)826647
150 _ _ |a SGA1 (Specific Grant Agreement 1) OF THE EUROPEAN PROCESSOR INITIATIVE (EPI)
|y 2018-12-01 - 2021-12-31
371 _ _ |a Atomic Energy and Alternative Energies Commission
|b CEA
|d France
|e http://www.cea.fr/
|v CORDIS
371 _ _ |a Chalmers University of Technology
|b Chalmers University of Technology
|d Sweden
|e http://www.chalmers.se/en/Pages/default.aspx
|v CORDIS
371 _ _ |a IDRYMA TECHNOLOGIAS KAI EREVNAS
|b FOUNDATION FOR RESEARCH AND TECHNOLOGYHELLAS
|d Greece
|e http://www.forth.gr
|v CORDIS
371 _ _ |a FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
|b Fraunhofer
|d Germany
|e http://www.fraunhofer.de
|v CORDIS
371 _ _ |a BULL SAS
|b BULL
|d France
|e http://www.bull.com
|v CORDIS
371 _ _ |a Swiss Federal Institute of Technology in Zurich
|b Swiss Federal Institute of Technology in Zurich
|d Switzerland
|e https://www.ethz.ch/en.html
|v CORDIS
371 _ _ |a SURFSARA BV
|d Netherlands
|e http://www.sara.nl
|v CORDIS
371 _ _ |a Karlsruher Institut für Technologie
|b KIT
|d Germany
|e http://www.kit.edu
|v CORDIS
371 _ _ |a CINECA CONSORZIO INTERUNIVERSITARIO
|b CINECA
|d Italy
|e http://www.cineca.it
|v CORDIS
371 _ _ |a EXTOLL GMBH
|d Germany
|e http://www.extoll.de
|v CORDIS
371 _ _ |a SEMIDYNAMICS TECHNOLOGY SERVICES SL
|b SEMIDYNAMICS
|d Spain
|e http://www.semidynamics.com
|v CORDIS
371 _ _ |a E4 COMPUTER ENGINEERING SPA
|b E4
|d Italy
|e http://www.e4company.com
|v CORDIS
371 _ _ |a SIPEARL
|d France
|e http://www.sipearl.com
|v CORDIS
371 _ _ |a PROVE&RUN
|b Prove & Run
|d France
|e http://www.provenrun.com
|v CORDIS
371 _ _ |a MENTA SAS
|d France
|e http://www.menta-efpga.com
|v CORDIS
371 _ _ |a INSTITUTO SUPERIOR TECNICO
|b IST
|d Portugal
|e http://www.tecnico.ulisboa.pt
|v CORDIS
371 _ _ |a SVEUCILISTE U ZAGREBU FAKULTET ELEKTROTEHNIKE I RACUNARSTVA
|b UNIZG-FER
|d Croatia
|e http://www.fer.unizg.hr
|v CORDIS
371 _ _ |a University of Pisa
|b UniPi
|d Italy
|e http://www.unipi.it/
|v CORDIS
371 _ _ |a ELEKTROBIT AUTOMOTIVE GMBH
|d Germany
|v CORDIS
371 _ _ |a Infineon Technologies (Germany)
|b Infineon Technologies (Germany)
|d Germany
|e https://www.infineon.com/
|v CORDIS
371 _ _ |a Grand Equipement National de Calcul Intensif (France)
|b GENCI
|d France
|e http://www.genci.fr/fr?lang=en
|v CORDIS
371 _ _ |a KALRAY SA
|b KALRAY
|d France
|e http://www.kalray.eu
|v CORDIS
371 _ _ |a University of Bologna
|b UNIBO
|d Italy
|e http://www.unibo.it/en/homepage
|v CORDIS
371 _ _ |a Forschungszentrum Jülich
|b Forschungszentrum Jülich
|d Germany
|e https://www.ptj.de/
|v CORDIS
371 _ _ |a BAYERISCHE MOTOREN WERKE AKTIENGESELLSCHAFT
|b BMW GROUP
|d Germany
|v CORDIS
371 _ _ |a STMICROELECTRONICS SRL
|d Italy
|e http://www.st.com
|v CORDIS
371 _ _ |a BARCELONA SUPERCOMPUTING CENTER - CENTRO NACIONAL DE SUPERCOMPUTACION
|b BSC
|d Spain
|e http://www.bsc.es
|v CORDIS
372 _ _ |a H2020-SGA-LPMT-2018
|s 2018-12-01
|t 2021-12-31
450 _ _ |a EPI SGA1
|w d
|y 2018-12-01 - 2021-12-31
510 1 _ |0 I:(DE-588b)5098525-5
|a European Union
|2 CORDIS
680 _ _ |a The EPI SGA1 project will be the first phase of the European Processor Initiative FPA, whose aim is to design and implement a roadmap for a new family of low-power European processors for extreme scale computing, high-performance Big-Data and a range of emerging applications. EPI SGA1 will: - Develop the roadmap for the full length of the EPI initiative - Develop the first generation of technologies through a co-design approach (IPs for general-purpose HPC processors, for accelerators, for trusted chips, software stacks and boards) - Tape-out of the first generation chip by integrating the IPs developed - Validate this chip in the HPC context and in the automotive context using a demonstration platform The project will deliver a high performance, low power processor, implementing vector instructions and specific accelerators with high bandwidth memory access. The EPI processor will also meet high security and safety requirements. This will be achieved through intensive use of simulation, development of a complete software stack and tape-out in the most advanced semiconductor process node. SGA1 will provide a competitive chip that can effectively address the requirements of the HPC, AI, automotive and trusted IT infrastructure markets.
909 C O |o oai:juser.fz-juelich.de:870376
|p authority:GRANT
|p authority
970 _ _ |a oai:dnet:corda__h2020::b37ce4a3bb5cdec008e05aa811e961f4
980 _ _ |a G
980 _ _ |a CORDIS
980 _ _ |a AUTHORITY

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