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@ARTICLE{Kindelmann:888295,
      author       = {Kindelmann, Moritz and Stamminger, Mark and Schön, Nino
                      and Rasinski, Marcin and Eichel, Rüdiger‐A. and Hausen,
                      Florian and Bram, Martin and Guillon, Olivier},
      title        = {{E}rosion behavior of {Y} 2 {O} 3 in fluorine‐based
                      etching plasmas: {O}rientation dependency and reaction layer
                      formation},
      journal      = {Journal of the American Ceramic Society},
      volume       = {104},
      number       = {3},
      issn         = {1551-2916},
      address      = {Westerville, Ohio},
      publisher    = {Soc.},
      reportid     = {FZJ-2020-04821},
      pages        = {1465-1474},
      year         = {2020},
      abstract     = {Even though advanced ceramics are widely applied as
                      consumables in semiconductor etching processes, the erosion
                      mechanisms and connected surface phenomena are not fully
                      understood. Through the interaction with reactive species
                      and ion bombardment during the plasma exposure, oxide
                      ceramic materials like Y2O3 are eroded by a physicochemical
                      mechanism. In this study, fundamental phenomena of
                      surface‐plasma interactions were investigated directly at
                      the surface as well as in the near‐surface region after
                      exposure to fluorine‐based etching plasmas. A
                      straightforward re‐localization technique was used to
                      investigate the microstructural features before and after
                      the plasma exposure for up to 2 hours. Electron microscopy
                      methods (scanning electron microscopy, electron backscatter
                      diffraction) were coupled with atomic force microscopy,
                      secondary ion mass spectroscopy, and transmission electron
                      microscopy to study the surface topography and the
                      corresponding reaction layer. Direct correlation of the
                      microstructure before plasma exposure with the surface
                      topography reveals a novel orientation‐dependent erosion
                      mechanism that forms plateau‐like structures. Furthermore,
                      the in‐depth analysis of the near‐surface area
                      highlights the influence of the applied bias voltage on the
                      physical damage and chemical gradient formation due to
                      plasma exposure. The combined investigation of surface
                      morphology and near‐surface properties reveals new
                      fundamental aspects of the erosion behavior of
                      polycrystalline yttria in CF4‐based etching plasmas.},
      cin          = {IEK-1 / IEK-4 / IEK-9},
      ddc          = {660},
      cid          = {I:(DE-Juel1)IEK-1-20101013 / I:(DE-Juel1)IEK-4-20101013 /
                      I:(DE-Juel1)IEK-9-20110218},
      pnm          = {131 - Electrochemical Storage (POF3-131) / HITEC -
                      Helmholtz Interdisciplinary Doctoral Training in Energy and
                      Climate Research (HITEC) (HITEC-20170406)},
      pid          = {G:(DE-HGF)POF3-131 / G:(DE-Juel1)HITEC-20170406},
      typ          = {PUB:(DE-HGF)16},
      UT           = {WOS:000592284700001},
      doi          = {10.1111/jace.17556},
      url          = {https://juser.fz-juelich.de/record/888295},
}