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@ARTICLE{Yu:902987,
      author       = {Yu, Jian and Li, Junjun and Zhao, Yilin and Lambertz,
                      Andreas and Chen, Tao and Duan, Weiyuan and Liu, Wenzhu and
                      Yang, Xinbo and Huang, Yuelong and Ding, Kaining},
      title        = {{C}opper metallization of electrodes for silicon
                      heterojunction solar cells: {P}rocess, reliability and
                      challenges},
      journal      = {Solar energy materials $\&$ solar cells},
      volume       = {224},
      issn         = {0927-0248},
      address      = {Amsterdam [u.a.]},
      publisher    = {NH, Elsevier},
      reportid     = {FZJ-2021-04733},
      pages        = {110993},
      year         = {2021},
      abstract     = {The crystalline silicon (c-Si) based technologies occupy
                      $95\%$ market share in the global photovoltaic (PV)
                      production capacity. The conversion efficiency of silicon
                      heterojunction (SHJ) solar cell in mass production has gone
                      beyond $23\%.$ The most pressing challenge hindering the
                      industrial scale expansion of SHJ solar cell currently is
                      the relatively high production cost as compared to the PERC
                      (passivated emitter and rear cell) product. The low
                      temperature silver paste utilized in the SHJ cell process
                      accounts significantly for about $30\%$ of the total
                      processing cost due to its large consumption. Copper plating
                      is of great current interest to silicon heterojunction
                      application, which has a high potential to cut down the cost
                      and improve cell efficiency by the remarkably reduced
                      shading loss, increased electrode conduction and fill
                      factor. However, there are still some critical issues need
                      to be systematically optimized and proven for mass
                      production. Selectively-deposited seed layer and
                      stripping-free plating resist are the key factors to
                      simplify the plating process. This paper gives a detailed
                      look into the development of copper metallization for SHJ
                      solar cell. Plating process involving seed layer formation
                      and patterning methods are explicated. The process
                      simplification and reliability are discussed aiming at its
                      employment in industrial production.},
      cin          = {IEK-5},
      ddc          = {620},
      cid          = {I:(DE-Juel1)IEK-5-20101013},
      pnm          = {1213 - Cell Design and Development (POF4-121)},
      pid          = {G:(DE-HGF)POF4-1213},
      typ          = {PUB:(DE-HGF)16},
      UT           = {WOS:000684447300002},
      doi          = {10.1016/j.solmat.2021.110993},
      url          = {https://juser.fz-juelich.de/record/902987},
}