TY  - JOUR
AU  - Bonnassieux, Yvan
AU  - Brabec, Christoph J
AU  - Cao, Yong
AU  - Carmichael, Tricia Breen
AU  - Chabinyc, Michael L
AU  - Cheng, Kwang-Ting
AU  - Cho, Gyoujin
AU  - Chung, Anjung
AU  - Cobb, Corie L
AU  - Distler, Andreas
AU  - Egelhaaf, Hans-Joachim
AU  - Grau, Gerd
AU  - Guo, Xiaojun
AU  - Haghiashtiani, Ghazaleh
AU  - Huang, Tsung-Ching
AU  - Hussain, Muhammad M
AU  - Iniguez, Benjamin
AU  - Lee, Taik-Min
AU  - Li, Ling
AU  - Ma, Yuguang
AU  - Ma, Dongge
AU  - McAlpine, Michael C
AU  - Ng, Tse Nga
AU  - Österbacka, Ronald
AU  - Patel, Shrayesh N
AU  - Peng, Junbiao
AU  - Peng, Huisheng
AU  - Rivnay, Jonathan
AU  - Shao, Leilai
AU  - Steingart, Daniel
AU  - Street, Robert A
AU  - Subramanian, Vivek
AU  - Torsi, Luisa
AU  - Wu, Yunyun
TI  - The 2021 flexible and printed electronics roadmap
JO  - Flexible and printed electronics
VL  - 6
IS  - 2
SN  - 2058-8585
CY  - Philadelphia, PA
PB  - IOP Publishing
M1  - FZJ-2022-01301
SP  - 023001 -
PY  - 2021
AB  - This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1–9), fabrication techniques (sections 10–12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies.
LB  - PUB:(DE-HGF)16
UR  - <Go to ISI:>//WOS:000657941200001
DO  - DOI:10.1088/2058-8585/abf986
UR  - https://juser.fz-juelich.de/record/906223
ER  -