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@ARTICLE{Bonnassieux:906223,
      author       = {Bonnassieux, Yvan and Brabec, Christoph J and Cao, Yong and
                      Carmichael, Tricia Breen and Chabinyc, Michael L and Cheng,
                      Kwang-Ting and Cho, Gyoujin and Chung, Anjung and Cobb,
                      Corie L and Distler, Andreas and Egelhaaf, Hans-Joachim and
                      Grau, Gerd and Guo, Xiaojun and Haghiashtiani, Ghazaleh and
                      Huang, Tsung-Ching and Hussain, Muhammad M and Iniguez,
                      Benjamin and Lee, Taik-Min and Li, Ling and Ma, Yuguang and
                      Ma, Dongge and McAlpine, Michael C and Ng, Tse Nga and
                      Österbacka, Ronald and Patel, Shrayesh N and Peng, Junbiao
                      and Peng, Huisheng and Rivnay, Jonathan and Shao, Leilai and
                      Steingart, Daniel and Street, Robert A and Subramanian,
                      Vivek and Torsi, Luisa and Wu, Yunyun},
      title        = {{T}he 2021 flexible and printed electronics roadmap},
      journal      = {Flexible and printed electronics},
      volume       = {6},
      number       = {2},
      issn         = {2058-8585},
      address      = {Philadelphia, PA},
      publisher    = {IOP Publishing},
      reportid     = {FZJ-2022-01301},
      pages        = {023001 -},
      year         = {2021},
      abstract     = {This roadmap includes the perspectives and visions of
                      leading researchers in the key areas of flexible and
                      printable electronics. The covered topics are broadly
                      organized by the device technologies (sections 1–9),
                      fabrication techniques (sections 10–12), and design and
                      modeling approaches (sections 13 and 14) essential to the
                      future development of new applications leveraging flexible
                      electronics (FE). The interdisciplinary nature of this field
                      involves everything from fundamental scientific discoveries
                      to engineering challenges; from design and synthesis of new
                      materials via novel device design to modelling and digital
                      manufacturing of integrated systems. As such, this roadmap
                      aims to serve as a resource on the current status and future
                      challenges in the areas covered by the roadmap and to
                      highlight the breadth and wide-ranging opportunities made
                      available by FE technologies.},
      cin          = {IEK-11},
      ddc          = {621.3},
      cid          = {I:(DE-Juel1)IEK-11-20140314},
      pnm          = {1212 - Materials and Interfaces (POF4-121) / 1213 - Cell
                      Design and Development (POF4-121) / 1214 - Modules,
                      stability, performance and specific applications (POF4-121)
                      / 1215 - Simulations, Theory, Optics, and Analytics (STOA)
                      (POF4-121) / 1221 - Fundamentals and Materials (POF4-122) /
                      1222 - Components and Cells (POF4-122)},
      pid          = {G:(DE-HGF)POF4-1212 / G:(DE-HGF)POF4-1213 /
                      G:(DE-HGF)POF4-1214 / G:(DE-HGF)POF4-1215 /
                      G:(DE-HGF)POF4-1221 / G:(DE-HGF)POF4-1222},
      typ          = {PUB:(DE-HGF)16},
      UT           = {WOS:000657941200001},
      doi          = {10.1088/2058-8585/abf986},
      url          = {https://juser.fz-juelich.de/record/906223},
}