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@ARTICLE{Gler:909588,
      author       = {Güler, Ezgi Nur and Distler, Andreas and Basu, Robin and
                      Brabec, Christoph J and Egelhaaf, Hans-Joachim},
      title        = {{F}ully solution-processed, light-weight, and ultraflexible
                      organic solar cells},
      journal      = {Flexible and printed electronics},
      volume       = {7},
      number       = {2},
      issn         = {2058-8585},
      address      = {Philadelphia, PA},
      publisher    = {IOP Publishing},
      reportid     = {FZJ-2022-03265},
      pages        = {025003 -},
      year         = {2022},
      abstract     = {Organic photovoltaic (OPV) devices have the potential to be
                      superior to other PV technologies forthe use in applications
                      that require very high flexibility or maximum specific
                      power(power-per-weight ratio), such as textile integration,
                      wearable electronics, or outer spaceapplications. However,
                      OPV devices also require encapsulation by barrier films to
                      reduce thedegradation driven by extrinsic factors, which in
                      turn limits their flexibility and leads to lowerspecific
                      power values. In this work, fully solution-processed
                      (including both electrodes)semitransparent organic solar
                      cells (OSCs) with performance comparable with
                      conventionalindium tin oxide-based devices are processed
                      directly onto different barrier films of varyingthicknesses.
                      Direct cell fabrication onto barrier films leads to the
                      elimination of the additionalpolyethylene terephthalate
                      substrate and one of the two adhesive layers in the final
                      stack of anencapsulated OPV device by replacing the
                      industrial state-of-the-art sandwich encapsulation witha
                      top-only encapsulation process, which yields significantly
                      thinner and lighter ‘product-relevant’PV devices. In
                      addition to the increase of the specific power to 0.38 W
                      g−1, which is more than fourtimes higher than
                      sandwich-encapsulated devices, these novel OSCs exhibit
                      better flexibility andsurvive 5000 bending cycles with 4.5
                      mm bending radius. Moreover, the devices show
                      comparablestability as conventionally encapsulated devices
                      under constant illumination (1 sun) in ambient airfor 1000
                      h. Finally, degradation under damp heat conditions (65 ◦C,
                      $85\%$ rh) was investigated andfound to be determined by a
                      combination of different factors, namely (UV) light soaking,
                      intrinsicbarrier properties, and potential damaging of the
                      barriers during (laser) processing.},
      cin          = {IEK-11},
      ddc          = {621.3},
      cid          = {I:(DE-Juel1)IEK-11-20140314},
      pnm          = {1213 - Cell Design and Development (POF4-121)},
      pid          = {G:(DE-HGF)POF4-1213},
      typ          = {PUB:(DE-HGF)16},
      UT           = {WOS:000788720300001},
      doi          = {10.1088/2058-8585/ac66ae},
      url          = {https://juser.fz-juelich.de/record/909588},
}