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@ARTICLE{Buca:910865,
author = {Buca, Dan and Bjelajac, Andjelika and Spirito, Davide and
Concepción, Omar and Gromovyi, Maksym and Sakat, Emilie and
Lafosse, Xavier and Ferlazzo, Laurence and von den Driesch,
Nils and Ikonic, Zoran and Grützmacher, Detlev and
Capellini, Giovanni and El Kurdi, Moustafa},
title = {{R}oom {T}emperature {L}asing in {G}e{S}n {M}icrodisks
{E}nabled by {S}train {E}ngineering},
journal = {Advanced optical materials},
volume = {10},
number = {22},
issn = {2195-1071},
address = {Weinheim},
publisher = {Wiley-VCH},
reportid = {FZJ-2022-04215},
pages = {2201024 -},
year = {2022},
abstract = {The success of GeSn alloys as active material for infrared
lasers could pave the way toward a monolithic technology
that can be manufactured within mainstream silicon
photonics. Nonetheless, for operation on chip, lasing should
occur at room temperature or beyond. Unfortunately, despite
the intense research in recent years, many hurdles have yet
to be overcome. An approach exploiting strain engineering to
induce large tensile strain in micro-disk made of GeSn alloy
with Sn content of $14 at\%$ is presented here. This method
enables robust multimode laser emission at room temperature.
Furthermore, tensile strain enables proper valence band
engineering; as a result, over a large range of operating
temperatures, lower lasing thresholds are observed compared
to high Sn content GeSn lasers operating at similar
wavelength.},
cin = {PGI-9 / JARA-FIT},
ddc = {670},
cid = {I:(DE-Juel1)PGI-9-20110106 / $I:(DE-82)080009_20140620$},
pnm = {5234 - Emerging NC Architectures (POF4-523)},
pid = {G:(DE-HGF)POF4-5234},
typ = {PUB:(DE-HGF)16},
UT = {WOS:000842331600001},
doi = {10.1002/adom.202201024},
url = {https://juser.fz-juelich.de/record/910865},
}